Advanced Packaging & Integration Lead

Entangled Future; Dublin; Hybrid; EUR 120,000 - 180,000; Full time

Job summary

Equal1 in Dublin (remote) seeks an experienced Advanced Packaging & Integration Lead to design packaging solutions for multi-chip silicon spin-qubit devices within a scalable quantum system. You will lead the high-level architecture, drive 3D integration strategies, and work with a multidisciplinary team to implement TSVs, fine-pitch micro-bumps, and flip-chip bonding for millikelvin operation.

You will collaborate with engineers and external partners, perform DC/RF simulations, and ensure

Qualifications

• 7+ years’ experience in 3D integration and advanced packaging, including TSVs, fine-pitch micro-bumps, and flip-chip bonding.
• Experience with 3D-IC layout, planning, and simulation platforms for multi-die co-design, TSV floorplanning, and vertical interconnect planning.
• Experience with multi-physics analysis tools such as Ansys HFSS/Q3D or equivalent for signal/power integrity, RF analysis, and cryogenic structural/thermal stress.
• Experience managing technical transfers and working closely with external semiconductor advanced packaging facilities, OSATs, or research partners.
• Proven ability to guide technical strategy and work effectively across multidisciplinary engineering teams.

Responsibilities

• Drive the high-level strategy and architectural design of 3D integrated circuits and multi-chip quantum modules.
• Develop advanced packaging solutions using TSVs, fine-pitch micro-bumps, and flip-chip bonding.
• Ensure packaging architectures and interconnects can withstand thermal cycling down to the millikelvin regime without delamination or loss of reliability.
• Contribute to early-stage architecture and co-design activities, ensuring the advanced packaging subsystem scales with the requirements of the overall quantum system.
• Develop simulation approaches to evaluate packaging and process options at DC and RF frequencies, including signal integrity, power integrity, thermal performance, and mechanical stress.
• Balance R&D execution with a strong focus on yield improvement, failure analysis, manufacturability, and long-term hardware reliability.

Skills

3D integration experience

Leadership / mentoring

Multi-physics analysis

Cryogenic packaging knowledge

Education

Master's or PhD in Electrical Engineering, Materials Science, Physics, Microelectronics, or related field

Tools

Ansys HFSS/Q3D

Job description

Advanced Packaging & Integration Lead at Equal1, Dublin (remote). A lead-level full time position in the Cryo-CMOS team, listed under hardware engineering.

We are seeking an experienced Advanced Packaging & Integration Lead to join our team and develop packaging solutions for multi-chip silicon spin-qubit devices within a scalable quantum system. In this role, you will work with a multidisciplinary team to drive the R&D of complex multi-chip modules utilising TSVs and micro-bumps, optimised for operation at millikelvin temperatures. You will have a significant influence on the physical architecture of next-generation quantum processors, shaping how advanced packaging subsystems integrate into the overall quantum computing solution.

Desired

• Experience with cryogenic electronics, semiconductor physics, or silicon spin qubits.
• Knowledge of material behaviour at extreme temperatures, including superconductors and low-loss dielectrics.
• Experience leading or mentoring engineers in a high-tech, fast-paced R&D environment.

Responsibilities

• Drive the high-level strategy and architectural design of 3D integrated circuits and multi-chip quantum modules.
• Develop advanced packaging solutions using TSVs, fine-pitch micro-bumps, and flip-chip bonding.
• Ensure packaging architectures and interconnects can withstand thermal cycling down to the millikelvin regime without delamination or loss of reliability.
• Contribute to early-stage architecture and co-design activities, ensuring the advanced packaging subsystem scales with the requirements of the overall quantum system.
• Develop simulation approaches to evaluate packaging and process options at DC and RF frequencies, including signal integrity, power integrity, thermal performance, and mechanical stress.
• Balance R&D execution with a strong focus on yield improvement, failure analysis, manufacturability, and long-term hardware reliability.
• Own relevant technical activities with external suppliers, OSATs, and research partners.
• Support the transfer of novel packaging designs into external manufacturing and advanced packaging lines.

Requirements

• Master’s or PhD in Electrical Engineering, Materials Science, Physics, Microelectronics, or a related field.
• 7+ years’ experience in 3D integration and advanced packaging, including TSVs, fine-pitch micro-bumps, and flip-chip bonding.
• Experience with 3D-IC layout, planning, and simulation platforms for multi-die co-design, TSV floorplanning, and vertical interconnect planning.
• Experience with multi-physics analysis tools such as Ansys HFSS/Q3D or equivalent for signal/power integrity, RF analysis, and cryogenic structural/thermal stress.
• Experience managing technical transfers and working closely with external semiconductor advanced packaging facilities, OSATs, or research partners.
• Proven ability to guide technical strategy and work effectively across multidisciplinary engineering teams.