Advanced Packaging & Integration Lead

Equal1; Dublin; Presencial; EUR 120 000 - 160 000; Tempo integral

Resumo da oferta

Equal1 is seeking an experienced Advanced Packaging & Integration Lead to shape packaging solutions for multi-chip silicon spin-qubit devices within a scalable quantum system. You will collaborate with a multidisciplinary team to drive R&D of complex multi-chip modules using TSVs and micro-bumps, optimized for millikelvin operation.

You will influence the physical architecture of next-generation quantum processors, guiding architecture, co-design activities, and transfer of designs to

Qualificações

• Master’s or PhD in Electrical Engineering, Materials Science, Physics, Microelectronics, or related field.
• 7+ years’ experience in 3D integration and advanced packaging including TSVs, fine-pitch micro-bumps, and flip-chip bonding.
• Experience with 3D-IC layout, planning, and simulation platforms for multi-die co-design, TSV floorplanning, and vertical interconnect planning.
• Experience with multi-physics analysis tools such as Ansys HFSS/Q3D or equivalent for signal/power integrity, RF analysis, and cryogenic structural/thermal stress.
• Experience managing technical transfers and working closely with external semiconductor advanced packaging facilities, OSATs, or research partners.
• Proven ability to guide technical strategy and work effectively across multidisciplinary engineering teams.

Responsabilidades

• Drive the high-level strategy and architectural design of 3D integrated circuits and multi-chip quantum modules.
• Develop advanced packaging solutions using TSVs, fine-pitch micro-bumps, and flip-chip bonding.
• Ensure packaging architectures and interconnects can withstand thermal cycling down to the millikelvin regime without delamination or loss of reliability.
• Contribute to early-stage architecture and co-design activities, ensuring the advanced packaging subsystem scales with the requirements of the overall quantum system.
• Develop simulation approaches to evaluate packaging and process options at DC and RF frequencies, including signal integrity, power integrity, thermal performance, and mechanical stress.
• Balance R&D execution with a strong focus on yield improvement, failure analysis, manufacturability, and long-term hardware reliability.
• Own relevant technical activities with external suppliers, OSATs, and research partners.
• Support the transfer of novel packaging designs into external manufacturing and advanced packaging lines.

Conhecimentos

3D integration

Advanced packaging

TSVs

Flip-chip bonding

Multi-die co-design

Signal integrity

RF analysis

Formação académica

Master's or PhD in Electrical Engineering, Materials Science, Physics, Microelectronics, or related field

7+ years in 3D integration and advanced packaging

Ferramentas

Ansys HFSS

Q3D

Descrição da oferta de emprego

We are seeking an experienced Advanced Packaging & Integration Lead to join our team and develop packaging solutions for multi-chip silicon spin-qubit devices within a scalable quantum system.

In this role, you will work with a multidisciplinary team to drive the R&D of complex multi-chip modules utilising TSVs and micro-bumps, optimised for operation at millikelvin temperatures. You will have a significant influence on the physical architecture of next-generation quantum processors, shaping how advanced packaging subsystems integrate into the overall quantum computing solution.

Main Duties and Responsibilities

• Drive the high-level strategy and architectural design of 3D integrated circuits and multi-chip quantum modules.

• Develop advanced packaging solutions using TSVs, fine-pitch micro-bumps, and flip-chip bonding.

• Ensure packaging architectures and interconnects can withstand thermal cycling down to the millikelvin regime without delamination or loss of reliability.

• Contribute to early-stage architecture and co-design activities, ensuring the advanced packaging subsystem scales with the requirements of the overall quantum system.

• Develop simulation approaches to evaluate packaging and process options at DC and RF frequencies, including signal integrity, power integrity, thermal performance, and mechanical stress.

• Balance R&D execution with a strong focus on yield improvement, failure analysis, manufacturability, and long-term hardware reliability.

• Own relevant technical activities with external suppliers, OSATs, and research partners.

• Support the transfer of novel packaging designs into external manufacturing and advanced packaging lines.

Experience and Qualifications

Required

• Master’s or PhD in Electrical Engineering, Materials Science, Physics, Microelectronics, or a related field.

• 7+ years’ experience in 3D integration and advanced packaging, including TSVs, fine-pitch micro-bumps, and flip-chip bonding.

• Experience with 3D-IC layout, planning, and simulation platforms for multi-die co-design, TSV floorplanning, and vertical interconnect planning.

• Experience with multi-physics analysis tools such as Ansys HFSS/Q3D or equivalent for signal/power integrity, RF analysis, and cryogenic structural/thermal stress.

• Experience managing technical transfers and working closely with external semiconductor advanced packaging facilities, OSATs, or research partners.

• Proven ability to guide technical strategy and work effectively across multidisciplinary engineering teams.

Desired

• Experience with cryogenic electronics, semiconductor physics, or silicon spin qubits.

• Knowledge of material behaviour at extreme temperatures, including superconductors and low-loss dielectrics.

• Experience leading or mentoring engineers in a high-tech, fast-paced R&D environment.