Test Development Engineer

HKGD-Tech Limited; Hong Kong; On-site; HKD 420,000 - 660,000; Full time

Job summary

HKGD-Tech Limited in Hong Kong is seeking a test engineer to develop wafer-level and package-level electrical test solutions for 3rd generation semiconductor power devices, including SiC MOSFETs and GaN HEMTs.

You will build KGD-oriented screening architectures, implement CP methodology, dynamic evaluation, and reliability-related stress tests, and validate test programs on ATE platforms such as Accotest STS8200 or equivalents.

Responsibilities

• Develop wafer-level and package-level electrical test solutions for 3rd generation semiconductor power devices including SiC MOSFET and GaN HEMT.
• Develop KGD-oriented screening architecture integrating CP methodology, dynamic evaluation, and reliability-related stress tests.
• Develop and validate test programs on ATE platforms (e.g., Accotest STS8200 or equivalent).
• Develop statistical evaluation methodology for yield and reliability screening. (SPC, DOE, Cp/Cpk).
• Support test hardware validation, probe card evaluation, and load board debugging.
• Establish acceptance criteria according to JEDEC / AEC-Q101 reliability standards.

Job description

• Develop wafer-level and package-level electrical test solutions for 3rd generation semiconductor power devices including SiC MOSFET and GaN HEMT.
• Develop KGD-oriented screening architecture integrating CP methodology, dynamic evaluation, and reliability-related stress tests.
• Develop and validate test programs on ATE platforms (e.g., Accotest STS8200 or equivalent).
• Develop statistical evaluation methodology for yield and reliability screening. (SPC, DOE, Cp/Cpk).
• Support test hardware validation, probe card evaluation, and load board debugging.
• Establish acceptance criteria according to JEDEC / AEC-Q101 reliability standards.