BEOL Process Integration Engineer for 2nm & 3DIC

QUALCOMM, Inc.; Sai Kung; On-site; HKD 900,000 - 1,200,000; Full time

Job summary

Qualcomm Semiconductor Limited invites applications for a Back-End Process Integration Engineer in Hong Kong. You will lead BEOL process integration strategy, drive technology development for advanced nodes, and partner with top foundries to enable 2nm and beyond.

Your work will influence product performance, power, area, and cost across next-gen SoCs and heterogeneous integration. The role requires strong collaboration with design, product engineering, reliability, and manufacturing teams.

Qualifications

• B.S., M.S., or Ph.D. in Electrical Engineering, Materials Science, Chemical Engineering, Physics, or a related field.
• Advanced degree (M.S./Ph.D.) preferred for Staff and Senior Staff levels.
• 5+ years of semiconductor industry experience in Back-End Process Integration, Technology Development

Responsibilities

• Lead BEOL process integration strategy and technology development for advanced nodes in partnership with foundries.
• Serve as Qualcomm’s primary technical interface for BEOL process definition, optimization, qualification, and manufacturing readiness.
• Drive pathfinding and qualification of advanced packaging technologies, including 2.5D/3DIC and heterogeneous integration.
• Translate PPAC requirements into robust process specifications and integration solutions.
• Optimize interconnect RC performance and evaluate process options to meet product goals.
• Investigate yield and reliability issues, perform root-cause analysis with foundry partners.

Skills

BEOL Process Integration

Interconnect Materials

Yield & Reliability

Customer-facing exposure

Statistical Process Control

Education

Bachelor's degree in Electrical Engineering or related field

Master's degree preferred for Staff

PhD preferred for Staff/Senior Staff

Tools

JMP

DOE

FMEA

Cpk/Ppk

SPC

Job description

Qualcomm Semiconductor Limited invites applications for a Back-End Process Integration Engineer in Hong Kong. You will lead BEOL process integration strategy, drive technology development for advanced nodes, and partner with top foundries to enable 2nm and beyond.

Your work will influence product performance, power, area, and cost across next-gen SoCs and heterogeneous integration. The role requires strong collaboration with design, product engineering, reliability, and manufacturing teams.