Signal and Power Integrity engineer

Arm; Cambridge; Hybrid; GBP 55,000 - 75,000; Full time

Job summary

A leading semiconductor company seeks an experienced Signal and Power Integrity Engineer in Cambridge. You will create and analyze innovative System-in-Package designs and direct SI/PI interface development. Ideal candidates have 5+ years in signal integrity, with proficiency in engineering tools like Ansys and Cadence. Strong communication skills are essential for collaboration across global teams to drive impactful technology solutions. This role supports hybrid work arrangements and offers an inclusive work culture.

Benefits

Flexible working arrangements

Diverse work environment

Professional growth opportunities

Qualifications

• Minimum 5 years' experience in System level Signal Integrity.
• Deep understanding of multi-port matrixes.
• Experience with SIPI analysis environments.

Responsibilities

• Create and analyze System-in-Package designs.
• Supervise lab evaluations and debugging.
• Provide technical directions to sub-workgroups.

Skills

Signal Integrity

System level design

Electromagnetic extraction

Communication skills

Mentorship

Education

Engineering degree or equivalent

Tools

Ansys

Cadence

Python

Job description

Overview

Location: Cambridge (UK) or Sophia (France)

Job Category: Hardware Engineering

Introduction

Are you enthusiastic about new technologies? This position is an excellent opportunity for an experienced and highly motivated Signal and Power Integrity engineer to join the SIPI team and work on the future of System-in-Package designs, focusing on finding the optimum implementations that will improve Arm IP performance.

The semiconductor industry transitioned from multichip modules, then to SoC and is now moving into advanced System-in-Package (SiP) which changes the influence of Arm IP. Arm IP will begin to span multiple pieces of silicon in a system and optimizing this interaction is critical for internal development and enabling partner success.

Job Purpose

The Experienced SIPI engineer will be in charge of creating and analysing novel System-in-Package designs as well as delivering robust design methodologies and silicon/platform electrical integrity solution spaces. Innovative power delivery techniques and interfaces will be key in emerging technologies as advanced packaging is growing in industry importance. He will need to create or supervise package designs then running specific packaging analysis tools. Senior engineers are expected to play a tech lead role.

The candidate will work closely with teams in UK, France, and other Arm locations on need basis. Candidate must have deep knowledge in interface design and constraints in order to participate in emerging interfaces definition, understand impact on Arm IP, and possibly influence the standard. Clear communication with other team members is important. Candidate may be expected to supervise lab evaluations of the on post-silicon chip, including debugging and solving any possible system level issues.

Essential Skills & Experience

• Engineering degree or equivalent
• You hold ideally 5 or more years of experience in System level Signal Integrity with focus on interfaces’ impact on systems.
• Be very good at working with SIPI analysis environments (Ansys suite, Cadence, or other)
• Have deep understanding of multi-port matrixes (S, Y, Z parameters)
• Possess good understanding of electromagnetic extraction methodologies and their limitations.
• Understanding of package drawing to effectively drive a design engineer and perform package drawing modifications tasks on occasional basis.
• Able to provide technical directions to the sub-workgroups and influencing key product/platform roadmap decisions.
• Pre-layout platform design guideline development for SI/PI interfaces.

Nice to have Skills & Experience

• Have good understanding SoC implementations and models (IBIS models, power models, impedance profiles of power delivery networks)
• Experience in System level Power Integrity with focus on package level PI trade-offs.
• Experienced in complete package design flow from ball map stage up to final tape-out and well versed with all the steps and setup required.
• Knowledge in packaging manufacturing steps, and their constraints
• Experience on advanced packaging (2.5D, 3D)
• Knowledge of Linux environment and scripting (Python, Skill,…)

Interpersonal Skills

• Be able to mentor other SIPI engineers
• Proficient in English with good communication skills, oral and written
• Self-motivated, looking to accept new challenges
• Ready to work in worldwide team setup and work seamlessly across teams.
• Attention to detail
• Pro-active and pragmatic with regards to problem solving
• Be willing to iteratively improve designs and repeatedly attempt to develop solutions to difficult problems

At Arm, we’re in a pivotal moment. As AI reshapes every major industry, from the largest data centers to the smallest personal devices, our mission is clear: to help solve some of the world’s greatest challenges through technology that reaches everyone.

The future of AI is being built on Arm. And our 10x Mindset is helping shape that future. The10xMindsetis how we frame our work for greater impact. It’s not about doing more or working harder. It’s about thinking differently, acting decisively and building in a way that scales;for our customers, our teams and our global ecosystem.

It’s inspired by a founder’s mentality. We ask bold questions, spot opportunities others might miss and stay focused on delivering outcomes that matter. Whether we’re reimagining architectures or rethinking collaboration across time zones, thismindsethelps us move forward with clarity and purpose.

Accommodations at Arm

At Arm, we want to build extraordinary teams. If you need an adjustment or an accommodation during the recruitment process, please email [e-mail]. To note, by sending us the requested information, you consent to its use by Arm to arrange for appropriate accommodations. All accommodation or adjustment requests will be treated with confidentiality, and information concerning these requests will only be disclosed as necessary to provide the accommodation. Although this is not an exhaustive list, examples of support include breaks between interviews, having documents read aloud, or office accessibility. Please email us about anything we can do to accommodate you during the recruitment process.

Hybrid Working at Arm

Arm’s approach to hybrid working is designed to create a working environment that supports both high performance and personal wellbeing. We believe in bringing people together face to face to enable us to work at pace, whilst recognizing the value of flexibility. Within that framework, we empower groups/teams to determine their own hybrid working patterns, depending on the work and the team’s needs. Details of what this means for each role will be shared upon application. In some cases, the flexibility we can offer is limited by local legal, regulatory, tax, or other considerations, and where this is the case, we will collaborate with you to find the best solution. Please talk to us to find out more about what this could look like for you.

Equal Opportunities at Arm

Arm is an equal opportunity employer, committed to providing an environment of mutual respect where equal opportunities are available to all applicants and colleagues. We are a diverse organization of dedicated and innovative individuals, and don’t discriminate on the basis of race, color, religion, sex, sexual orientation, gender identity, national origin, disability, or status as a protected veteran.