Senior PCB Layout Engineer — High-Speed RF & Mixed-Signal

Harris Geospatial Solutions

Tewkesbury

Hybrid

GBP 60,000 - 90,000

Full time

14 days+
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Benefits offered by this job

Hybrid working
Relocation assistance
Private medical insurance
Pension scheme
Life Assurance
Group income protection
Flexible opt-in extras
Mental health support

Job summary

L3Harris UK is seeking an experienced Senior PCB Layout Engineer to join our GS2 division. You will design multi-layer PCBs (4-20 layers), collaborate with Electronic Design and Mechanical teams, and ensure layouts meet functional and physical requirements.

In this role you will mentor junior engineers, coordinate with PCB fabricators, and contribute to high-speed digital and RF designs using Siemens Xpedition. A security clearance is preferred and relocation assistance is available.

Qualifications

  • Demonstrated expertise in layout of complex high-speed digital and RF designs.
  • Experience with rigid and flex-rigid board technologies.
  • Knowledge of IPC 2221 placement and routing guidelines.
  • Experience with DFM/DFT with PCB suppliers.
  • Experience using PLM software for PCB data configuration control.
  • Familiarity with high pin count devices such as FPGAs/CPLDs.

Responsibilities

  • Implement PCB layouts for 4–20 layer rigid and flex-rigid PCBs with micro, blind and buried vias as required.
  • Collaborate with electronic design and mechanical engineering teams to meet requirements.
  • Generate PCB manufacturing and assembly drawings.
  • Work with PCB fabricators to align layouts with capabilities.
  • Maintain land patterns and library for new parts.
  • Coach and mentor junior team members.

Skills

High-speed digital design
RF design
PCB layout
Multi-layer PCB
Mentoring
DFM/DFT
Siemens Xpedition
PLM software
Flex-rigid PCB
Security clearance

Tools

Siemens Xpedition Enterprise
Aras Innovator
Windchill
Siemens I/O Optimizer

Job description

L3Harris UK is seeking an experienced Senior PCB Layout Engineer to join our GS2 division. You will design multi-layer PCBs (4-20 layers), collaborate with Electronic Design and Mechanical teams, and ensure layouts meet functional and physical requirements.

In this role you will mentor junior engineers, coordinate with PCB fabricators, and contribute to high-speed digital and RF designs using Siemens Xpedition. A security clearance is preferred and relocation assistance is available.

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