Senior Electrical Design Engineer - Si/SiC Power Modules

Microchip Technology Inc. (China); Caldicot; On-site; GBP 50,000 - 70,000; Full time

Job summary

Microchip Technology Inc. in Caldicot is seeking an experienced Electrical Design Engineer to lead the electrical design and simulation of Si and SiC power modules. You will optimize performance, reliability, and manufacturability using advanced tools.

You will collaborate with a multi-disciplinary team of engineers across materials, mechanical, electronics, and packaging to push boundaries and deliver next generation products. Travel internationally may be required.

Qualifications

• Bachelor’s or Master’s degree in Electrical Engineering or related field.
• 3+ years of experience in power module design, Si and SiC.
• Proficiency in Altium Designer for schematics and layouts.
• Experience with electrical simulation tools such as SPICE and PLECS.
• Experience with electromagnetic and thermal analysis tools like ANSYS.

Responsibilities

• Design and develop electrical layouts and schematics for Si and SiC power modules.
• Perform electrical simulations to analyze circuit behavior and optimize switching performance.
• Conduct electromagnetic field simulations to minimize parasitics and ensure target specs.
• Evaluate thermal performance in conjunction with electrical design.
• Prepare detailed technical documentation including schematics, reports, and test plans.

Skills

Altium Designer

Power electronics

Electrical design

SPICE

PLECS

ANSYS Maxwell

ANSYS Q3D

ANSYS Icepak

Thermal analysis

Education

Bachelor’s or Master’s degree in Electrical Engineering

Tools

Altium Designer

SPICE

PLECS

ANSYS Maxwell

ANSYS Q3D

ANSYS Icepak

Job description

Microchip Technology Inc. in Caldicot is seeking an experienced Electrical Design Engineer to lead the electrical design and simulation of Si and SiC power modules. You will optimize performance, reliability, and manufacturability using advanced tools.

You will collaborate with a multi-disciplinary team of engineers across materials, mechanical, electronics, and packaging to push boundaries and deliver next generation products. Travel internationally may be required.