Senior Analog / Mixed-Signal Design Engineer

University of Southampton; Portsmouth, Todmorden; On-site; GBP 70,000 - 95,000; Full time

Job summary

University of Southampton is seeking a Senior Analog / Mixed-Signal Design Engineer to provide specialist design expertise for PoC projects, focusing on PHY-level interfaces at die-to-die boundaries. The role includes physical design at integration level, floorplanning and interface layout across dies and packaging substrates, with a goal to develop HI demonstrators.

You will work with cross-disciplinary teams to resolve analog/mixed-signal interface challenges and contribute to reusable design

Qualifications

• Strong practical experience in analog/mixed-signal IC design.
• Understanding of semiconductor design flows and manufacturing.
• Experience with PHY-level and die-to-die interfaces.

Responsibilities

• Provide specialist design expertise across PoC projects.
• Perform floorplanning, I/O ring planning and interface layout.
• Develop reusable design methodologies and assets.
• Engage with industry partners and participate in workshops.

Skills

Analog IC design

Mixed-Signal design

PHY interfaces

Semiconductor packaging

PDK flows

Education

Level 7 or 8 qualification

Tools

ASIC/SoC development tools

Job description

As Senior Analog / Mixed-Signal Design Engineer, you will provide specialist design expertise across co-creation Proof-of-Concept (PoC) projects, with particular responsibility for PHY-level interfaces at die-to-die boundaries. Your work will include drivers, receivers, ESD structures, termination and clocking circuits, tailored to specific process nodes and packaging technologies.
You will undertake physical design at the integration level, including floorplanning, I/O ring planning and interface layout across dies, interposers and packaging substrates. Defining integration-level requirements and interface specifications, you will work with specialist colleagues across digital design and verification to resolve analog/mixed-signal interface challenges.
Alongside project delivery, you will help develop reusable design methodologies and assets, becoming the Technical Authority in key technology areas such as PHY-level interfaces, custom pad circuits and analog/digital interfaces. Working directly with the Co-Creation Project Lead and industry partner design teams, you will apply these capabilities to the development of functioning HI demonstrators and support partners in adopting the Centre's reusable design assets.
You will also contribute to technical workshops and design masterclasses to upskill the UK design community and represent the Centre's analog/mixed-signal design and integration capabilities at industry events and conferences.

We are looking for a self-starter who can work proactively and collaboratively to achieve project outcomes. You will possess either considerable work experience, vocational training or a formal qualification at Level 7 or 8.

You will have strong practical experience in analog/mixed-signal IC design, with the technical expertise to design and integrate circuits, such as PHY-level interfaces, drivers, receivers, ESD structures, termination and clocking. You will also have a strong understanding of semiconductor design and manufacturing, including semiconductor design flows, PDKs, ASIC/SoC development, advanced packaging processes and design-for-test.

Able to work effectively across technical disciplines, you will be confident engaging with industry design teams, translating partner requirements into practical engineering solutions and contributing your expertise to complex Heterogeneous Integration projects.

About CHIMES IKC

The CHIMES (Centre for Heterogeneous Integrated Micro-Electronic Systems) Innovation and Knowledge Centre (IKC) is one of four national centres funded by UKRI to support the UK electronics and semiconductor industry. The Centre exists to accelerate the adoption and commercialisation of Heterogeneous Integration (HI) across the UK supply chain. This is a fantastic opportunity for an engineer with practical experience in analog/mixed-signal IC design, technical expertise in circuit design and integration and a strong understanding of semiconductor design and manufacturing. Working on PHY-level and die-to-die interfaces, custom pad circuits and advanced semiconductor packaging, you will work at the forefront of semiconductor innovation, developing functioning Heterogeneous Integration demonstrators that solve real-world engineering challenges.