Process Engineer (OSAT)

Custom Interconnect Limited; Andover; On-site; GBP 45,000 - 65,000; Full time

Job summary

Custom Interconnect Limited is seeking an engineer to support wafer process, die bond, wire bond or encapsulation within semiconductor packaging. The role covers operation, development and maintenance of processes and equipment.

You will work with Lead/Senior Engineers on process design, NPI, data collection and quality investigations to drive continuous improvements on the production floor.

Qualifications

• HNC or HND in engineering or science is required.
• 1 year minimum in engineering/manufacturing environments.
• Degree qualification (BEng/MEng) preferred for progression.

Responsibilities

• Production Support: assist clean room and production supervision, train operators, troubleshoot equipment, write SOPs and assembly instructions.
• Preventative Maintenance: define/monitor daily, weekly, monthly, quarterly tasks; support annual service and spare part stocks; back-up process software.
• Process Design and Set-up: review documents, build prototypes for NPI, document new assembly processes and run NPI batches.
• Process Engineering: monitor CPk/PpK, select measurement systems, collect manufacturing data, use SPC for process control, support equipment sourcing.
• Quality Support: assist auditors, advise on calibration, support 8D and PFMEA investigations.
• R&D: design trials, identify training needs, conduct research projects, engage suppliers, stay updated on state-of-the-art in semiconductor packaging.

Skills

Production Support

Maintenance Planning

Process Design

Data Analysis

Quality Assurance

Education

HNC or HND in engineering/science

BEng/MEng degree (preferred)

Job description

Hours:38.5 hours per week
Monday - Thursday: 0830 - 1700, Friday: 08:30 - 1530

Reporting to:Lead Engineer (OSAT)

About this Role

• To function as an engineer within a key section of CIL’s Semiconductor Packaging capability – either Wafer Process, Die Bond, Wire Bond or Encapsulation.
• To support the process Lead Engineers in ensuring the operation, development and continual maintenance of all aspects of the assigned Semiconductor Packaging process activity and its equipment.

PRIMARY ROLES & RESPONSIBILITIES

• Production Support: support/advise on clean room and production team supervision, equipment/technical matters, training and development; train and evaluate Production-led training of operators, supervisors and technicians; troubleshoot problems with equipment and/or assembly/product quality as identified by Production; write equipment operational SOPs for production reference and training; write product assembly instructions and publish supporting documents for Production Team reference
• Preventative Maintenance: define and document low level Daily and Weekly and higher level Monthly Quarterly maintenance tasks as part of standard operational procedures; define and monitor schedules for DWMQ maintenance tasks to ensure equipment maintenance schedules are met; support the Maintenance Team to ensure equipment annual service requirements are met; support the Maintenance Team in fault-find, repair and support of service engineers in event of equipment breakdown; use occurrences of equipment breakdown or process drift to identify opportunities for improvement; support Senior and Lead Engineers, senior management and IT teams to identify and maintain stocks of critical spares, machine consumables, and to ensure programs or other process-critical software is backed‑up to a CIL server location, or other suitable and safe storage media, for ease of retrieval as and when required.
• Process Design and Set-up: review customer documents and materials to build prototypes for new and existing customers; support the New Product Introduction program with the build of new products; design, set-up and document new product assembly processes and produce NPI batches for customer evaluation; evaluate new product assembly processes for quantity uplift and design/implement improvements for increased throughput; support the Lead and Senior Engineers to highlight potential issues concerning Design for Manufacture.
• Process Engineering: monitor and evaluate production process short-term/long-term performance using Cpk and Ppk statistics; evaluate suitability of measurement systems for CTQ product measurables; design and implement systems to collect manufacturing data from equipment and measurement systems; collect and use production data to monitor product CTQs using control chart statistics and SPC to ensure established processes are operating within agreed/acceptable limits; statistical analysis of production data to identify and implement opportunities for improvement; support the Lead and Senior Engineers and senior management in identifying the need for manufacturing equipment and equipment specifications/configurations; attend in-person first-user on-site training sessions as provided by equipment suppliers.
• Quality Support: provide technical support for internal/external auditors; advise on measurement system calibration requirements and support collection/despatch of items for external calibration; support Quality Team investigations into PRN data, help identify root causes and implement improvements; support with Quality 8D investigations, help identify root causes and implement improvements; support Quality Team with design and continuous evaluation of PFMEA documents.
• Research & Development: Design trials/tests to better understand existing processes and/or assemblies and identify improvements; identify training needs and design training/development plans to continuously improve team capabilities/knowledge; carry out research projects on subject areas of personal/team interest and report findings to improve team/company knowledge; attend exhibitions and shows when required to maintain contacts with suppliers and ensure an up-to-date knowledge of the “state‑of‑the‑art” in aspects of semiconductor packaging process; use knowledge from process and equipment development projects, monitoring of established production processes to support the Lead Engineer and drive improvements in semiconductor process.

Qualifications

• Minimum Education: An HNC or HND in a relevant engineering or scientific discipline.
• Preferable Education: A degree qualification; BEng/MEng in engineering or scientific disciplines e.g. electronics, physics, mechanical engineering.
• Minimum Experience: 1 year working in an engineering and/or manufacturing facility.
• Preferable Experience: 2 years working with an electronics, microelectronics or semiconductor manufacturing facility.