Process Engineer

TT Electronics

Bedlington

On-site

GBP 35,000 - 50,000

Full time

14 days+

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Benefits offered by this job

Competitive salary
Enhanced pension contributions
Healthcare cashback plan
Employee assistance programme
Site incentive plan
Financial wellbeing benefit
Cycle to work scheme
Discounted gym membership
5 weeks annual leave plus bank holidays

Job summary

TT Electronics in Bedlington is searching for a dedicated Process Engineer to enhance our Chip and Wire Assembly operations. This crucial position involves optimizing manufacturing processes, troubleshooting equipment, and collaborating with cross-functional teams to ensure top-quality product outputs.

The ideal candidate will possess a degree in engineering, with hands-on experience in operations and a strong grasp of manufacturing principles. We offer a competitive salary and a supportive working environment focused on health and sustainability.

Qualifications

  • Degree in a relevant engineering discipline or equivalent experience.
  • Understanding of metallurgy, adhesives, and physics principles.
  • Hands-on experience with pick-and-place and wire bonders.

Responsibilities

  • Troubleshoot manufacturing equipment issues.
  • Optimize processes for microelectronics products.
  • Commission new manufacturing equipment.

Skills

Metallurgy knowledge
Lean manufacturing principles
Pick-and-place operation
Wire bonding expertise
Interpersonal skills
Attention to detail
MS Office proficiency

Education

Degree in relevant engineering discipline

Tools

MS Office

Job description

Company Overview

TT Electronics is a global manufacturer of electronic solutions dedicated to improving safety, health, and sustainability worldwide. We focus on engineering advanced electronics that benefit our planet and people for future generations.

Role Overview and Responsibilities

At TT Electronics, Bedlington, we are seeking a highly motivated and detail-oriented Process Engineer to join the Engineering team in our Chip and Wire Assembly function. This role is pivotal within a fast-paced microelectronics manufacturing environment, supporting the development, optimisation, and control of critical microelectronics packaging processes to ensure product quality, yield, and reliability meet stringent industry standards.

The successful candidate will drive continuous improvement across die attach, wire bonding, encapsulation, and related assembly operations. Working closely with cross‑functional teams including production, quality, and equipment engineering, the Process Engineer will play a key role in introducing new products, resolving process issues, and implementing robust manufacturing solutions.

Key responsibilities include:

  • Day‑to‑day support of production, troubleshooting manufacturing equipment issues in a timely manner.
  • Developing and optimising processes for manufacturing microelectronics products.
  • Pro‑actively identify opportunities to improve yield and manufacturing efficiency, and support continuous improvement activities.
  • Commissioning and qualifying new manufacturing equipment.
  • Producing technical documentation such as operating instructions, inspection standards and PFMEAs.
  • Supporting the transition of products from NPI to production.
  • Providing training and support to engineers and production operators.
  • Gaining and maintaining detailed knowledge of the production process and equipment.
  • Liaising with customers and suppliers.
  • Ensuring safe working practices are adopted and health and safety legislation is adhered to when implementing new products, materials, processes, or equipment.

On occasion, this role may require visits to customers or suppliers and may also involve foreign travel.

Qualifications, Skills and Attributes

What we are looking for:

  • A degree in a relevant engineering discipline or equivalent experience.
  • Technical knowledge and deep understanding of metallurgy, adhesives, and the underlying physics principles behind the processes.
  • Hands‑on experience operating and programming pick‑and‑place and wire bonders.
  • Sound knowledge of engineering principles and concepts; Lean, 8D, Design of experiments.
  • Excellent interpersonal skills and ability to build strong relationships and communicate effectively at all levels.
  • Demonstrated organisational, planning and programme skills with careful attention to detail.
  • Works well within a team and under pressure to meet strict deadlines.
  • Competence with MS Office applications for documentation and presentation of reports.

The following would enhance your application but are not essential:

  • Familiarity with electronics & mechanical CAD design.
  • Awareness of manufacturing hybrid circuits and multi‑chip modules (chip and wire assembly).
  • Knowledge of lean manufacturing tools and statistical process techniques.
  • Familiarity with MIL standards and design for high‑reliability environments.
Benefits
  • Competitive Salary
  • Enhanced pension contributions
  • Healthcare cashback plan
  • Employee assistance programme
  • Site incentive plan
  • Financial wellbeing benefit
  • Discounted online and high‑street shopping and lifestyle vouchers
  • Cycle to Work Scheme
  • Discounted RAC membership
  • Discounted Gym membership
  • 5 weeks (in hours) annual leave plus bank holidays
  • A supportive and friendly working environment with a focus on wellbeing and sustainability
Employment Conditions

TT Electronics is committed to Equality, Diversity and Inclusion and actively encourages applications from under‑represented groups. Many roles are subject to security and export control restrictions which may apply to nationality. All successful candidates must achieve the Baseline Personnel Security Standard (BPSS) and TT Electronics cannot sponsor work visas for this role.

We hold health and safety in the highest regard; a successful candidate will be required to pass a pre‑employment drug and alcohol screening.

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