Lead Electronics Engineer - Space Systems (FPGA/ASIC)

Platform Recruitment; Oxford; Hybrid; GBP 90,000 - 110,000; Full time

Job summary

Platform Recruitment partners with a leading technology organisation in Oxford to recruit a Lead Electronics Engineer for defence and space systems. The role oversees the full hardware lifecycle from specification and design through to manufacture, integration and space qualification.

The successful candidate will lead complex hardware development, design high-speed digital circuits with FPGA/ASIC and SerDes, and direct multi‑layer HDI PCB projects while mentoring cross‑disciplinary teams.

Qualifications

• Extensive experience in electronic hardware or electronics product design.
• Background in space, aerospace, defence or safety-critical industries.
• Strong high-speed digital design and SerDes interconnect experience.
• Experience designing complex multi-layer HDI PCBs.
• Knowledge of FPGA or ASIC-based systems.
• Experience with schematic capture, PCB design and circuit simulation tools.
• Ability to lead complex projects and influence multidisciplinary teams.

Responsibilities

• Lead complex electronic hardware development and manufacturing activities.
• Design high-speed digital circuits featuring FPGA, ASIC and SerDes technologies.
• Direct the design of complex multilayer and HDI PCBs.
• Support hardware, software and systems integration, validation and qualification.
• Coordinate internal engineers, PCB layout teams and external manufacturing partners.
• Provide technical leadership and mentoring across multidisciplinary engineering teams.

Skills

High-speed design

FPGA/ASIC

HDI PCB design

Schematic capture

PCB design

Circuit simulation

Team leadership

Job description

Platform Recruitment partners with a leading technology organisation in Oxford to recruit a Lead Electronics Engineer for defence and space systems. The role oversees the full hardware lifecycle from specification and design through to manufacture, integration and space qualification.

The successful candidate will lead complex hardware development, design high-speed digital circuits with FPGA/ASIC and SerDes, and direct multi‑layer HDI PCB projects while mentoring cross‑disciplinary teams.