Mechanical Engineer (Electronic Warfare)

Harmattan AI; Paris; Sur place; EUR 70 000 - 95 000; Plein temps

Résumé du poste

Harmattan AI is seeking a Mechanical Engineer for its Electronic Warfare team to design mechanical structures and packaging for RF/EW electronics, from concept to field deployment. You will translate RF and electronics constraints into robust mechanical designs, collaborating with HW, software, GNC and ML teams.

You will own mechanical design from concept through prototyping and validation, driving thermal management, shielding, and cabling in a high-stakes defense environment.

Qualifications

• Experience in RF electronic packaging is a must.
• RF experience (radar, radio or EW) is a strong plus.
• Strong background in mechanical design, thermal management and packaging.
• Broad engineering culture with understanding of electrical and embedded systems.
• MSc in Mechanical Engineering; PhD is a plus.

Responsabilités

• RF Electronic Packaging: design mechanical packaging for RF and high-power electronics.
• Thermal Management: design thermal solutions for high-power, high-density electronics.
• Shielding & cabling: integrate EMI/RF shielding and manage cable routing and constraints.
• Mechanical Design: own mechanical design from concept through prototyping and validation.
• Technical Coordination: collaborate across HW, software, GNC and ML teams on interfaces.
• System Reviews & Documentation: contribute to design and architecture reviews and maintain docs.

Connaissances

RF packaging

Mechanical design

Thermal management

Packaging

Analytical skills

Communication

Embedded awareness

Formation

MSc in Mechanical Engineering

PhD in Mechanical Engineering (plus)

Description du poste

About Us

Harmattan AI is a next-generation defense prime building autonomous and scalable defense systems. Following the close of a $200M Series B, valuing the company at $1.4 billion, we are expanding our teams and capabilities to deliver mission-critical systems to allied forces.

Our work is guided by clear values: building technologies with real-world impact, pursuing excellence in everything we do, setting ambitious goals, and taking on the hardest technical challenges. We operate in a demanding environment where rigor, ownership, and execution are expected.

About The Role

As a Mechanical Engineer within our Electronic Warfare team, you will design the mechanical structures and packaging that house and protect our EW/SIGINT electronics in demanding field conditions – from concept to field deployment. You will translate RF and electronic constraints into robust mechanical designs, working hand-in-hand with hardware, software, GNC and ML teams.

Responsibilities

• RF Electronic Packaging: Design mechanical packaging for RF and high-power electronics (a core requirement of the role).


• Thermal Management: Design thermal solutions for high-power, high-density electronics.


• Shielding & Cabling: Integrate EMI/RF shielding and manage cable routing and constraints.


• Mechanical Design: Own mechanical design from concept through prototyping and validation.


• Technical Coordination: Collaborate across HW, software, GNC and ML teams on integration and technical interfaces.


• System Reviews & Documentation: Contribute to design and architecture reviews and maintain documentation and traceability.

Candidate Requirements

• Experience in RF electronic packaging is a must.


• Previous RF experience (radar, radio or EW) is a strong plus, to keep the associated constraints in mind (shielding, thermal, cabling, etc.).


• Strong background in mechanical design, thermal management and packaging.


• Broad engineering culture with understanding of electrical and embedded systems.


• MSc in Mechanical Engineering; PhD is a plus.


• Rigorous, structured and mission-driven mindset with strong analytical skills.


• Excellent communication and documentation abilities.

We look forward to hearing how you can help shape the future of autonomous defense systems at Harmattan AI.