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SCINTIL Photonics in Grenoble seeks an expert III/V Process Integration, Layout and Characterization Engineer to drive evaluation and optimization of advanced technologies. You will own layout definition aligned with process flow, coordinate with external foundries, and contribute to device fabrication, testing and characterization.
You will collaborate across Design, Process Development, Packaging and Testing teams, and travel regularly in a fabless, multi-partner environment.
As a member of the R&D, the III/V Process Integration, Lay-out and Characterization Engineer will play a key role in the evaluation, selection and optimization of advanced technologies. The selected candidate will work directly with external III-V foundry partners and will also coordinate closely with internal departments (design, industrialization, packaging, testing).
The candidate will own layout definition aligned with process integration flows, drive interactions with foundries, and contribute to device fabrication, testing, and characterization.
§ Define and optimize process integration flows for photonic devices
§ Translate process flows into robust layout designs (mask layouts)
§ Ensure layout compliance with foundry design rules (DRC, LVS when applicable)
§ Collaborate with design teams to ensure feasibility and performance
§ Act as primary technical contact with external foundries (fabless model)
§ Manage tape-outs, process reviews, and fabrication iterations
§ Support debugging and yield improvement with foundry partners
§ Contribute to device fabrication in partner or internal facilities when needed
§ Perform electro-optical characterization of devices
§ Analyze results and close the loop with design and process improvements
§ Work closely with R&D and industrialization team members across Design, Process development, Packaging and Testing
§ Support problem-solving across the full product lifecycle
§ Master's degree or PhD in Materials Science, Semiconductor Physics, or a related field
§ Minimum 5 years of experience in process integration (PIC, semiconductor, or MEMS) (or PhD + 2 years)
This position will require some regular travels abroad (Europe, US, Asia) (1 / quarter).