3D Integration Engineer H/F

Alice & Bob; Aubervilliers; In loco; EUR 75.000 - 110.000; Tempo pieno

Vantaggi offerti da questo lavoro

BSPCE plan

Direct IP Bonus program

Flexible remote policy (up to 40%)

Parental plan and child care support

Urban Sports Club membership

Menta health support

Descrizione del lavoro

Alice & Bob is seeking a skilled 3D integration specialist to advance QPU assembly in the Process Integration team within the Quantum Hardware & Infrastructure department.

You will work across nanofabrication, assembly, and scalable QPU design, collaborating with teams from roadmap definition to fabrication, packaging, and validation to enable next‑gen superconducting qubit technology.

Competenze

• PhD or MSc in physics, materials science, electrical engineering, or microelectronics.
• 3+ years of 3D integration experience, including flip‑chip / bump bonding and TSV processing.
• End-to-end development and qualification of an integration process brick.

Mansioni

• Explore, benchmark 3D assembly technologies for QPUs under cryogenic constraints.
• Develop and qualify core 3D integration building blocks (airbridges, flip-chip, TSV, MLW).
• Design and drive integration test plans with cross‑functional teams.
• Build scalable, well‑documented integration procedures for company growth.
• Investigate and root-cause integration issues to align with specs.

Conoscenze

3D integration

Flip-chip bonding

TSV processing

Failure analysis

Cryogenic operation knowledge

Formazione

PhD in physics

MSc in physics

Strumenti

SEM

X-ray inspection

Profilometry

Descrizione del lavoro

Alice & Bob is developing the first universal, fault-tolerant quantum computer to solve the world’s hardest problems.

The quantum computer we envision building is based on a new kind of superconducting qubit: the Schrödinger cat qubit . In comparison to other superconducting platforms, cat qubits have the astonishing ability to implement quantum error correction autonomously!

We're a diverse team of 250+ brilliant minds from over 35 countries united by a single goal: to revolutionise computing with a practical fault-tolerant quantum machine. Are you ready to take on unprecedented challenges and contribute to revolutionising technology? Join us, and let's shape the future of quantum computing together!

Join our

Process Integration team , within the Quantum Hardware & Infrastructure department, and help turn cutting-edge QPU designs into physical reality.

This role sits right at the crossroads of nanofabrication, assembly, and scalable QPU design. You'll work hand in hand with teams across our entire hardware organization — from roadmap definition to fabrication, packaging, and validation — to build the 3D integration technologies that will power the next generation of our quantum processors.

Responsabilities

Explore, identify, and benchmark the most promising 3D assembly technologies for QPUs, evaluated against the demanding constraints of superconducting circuits: material and process compatibility, microwave performance, and cryogenic reliability

Develop and qualify our core 3D integration building blocks — airbridges, flip-chip bonding, TSV, multi-layer wiring (MLW), superconducting interconnects, and wafer-level assembly — working closely with our fabrication and packaging teams

Design and drive integration test plans in collaboration with cross-functional teams

Build scalable, well-documented integration procedures that will support the company as it grows

Dive into integration issues and technical anomalies, tracking them down to their root cause and making sure everything stays aligned with our specifications and performance targets

Be the go-to technical contact for 3D integration with our external foundries, packaging partners, and equipment vendors, working alongside our foundry partnerships expert

Requirements

PhD or MSc in physics, materials science, electrical engineering, or microelectronics, with strong hands‑on cleanroom experience

3+ years of demonstrated 3D integration experience, in flip‑chip / bump bonding and TSV processing.

Proven track record of developing and qualifying an integration process brick end to end — from literature survey and test‑vehicle design through experiments, data analysis, and go/no‑go decision

Solid grounding in failure analysis and reliability assessment of 3D interconnects: cross‑sectioning, SEM, X‑ray inspection / tomography, profilometry, electrical test structures

Understanding of superconducting QPU fabrication and of what cryogenic operation demands from materials and interfaces is a plus

Recruitment process

Screening Call with Alexandra Talent Acquisition Specialist (30 min)

Hiring Manager Interview with the Hiring Manager (45 min)

Technical Interview/Presentation with the Team (90 min)

Leadership and Fit Interview (60 min)

Benefits

• Our success is your success: own it with our
• BSPCE plan
• Direct IP Compensation: Earn substantial bonuses for driving the core patents that define our quantum architecture.
• Flexible
• remote policy, up to 40 % a month
• A
• Parental plan including additional benefits such as crèche support or additional days‑off to take care of under 12 years old children
• Subsidized membership with Urban Sports Club
• Mental health support withmoka.care
• 25-day vacation policy (as per French law) + RTT
• Half of transportation cost coverage (as per French law), or yearly allowance for the die‑hard bicycle users
• Competitive health coverage, with Alan.
• Meal vouchers with Swile, as well as access to a fully equipped and regularly stocked kitchen
• French language courses covered by the company for those interested

Research shows that women might feel hesitant to apply for this job if they don't match 100% of the job requirements listed. This list is a guide, and we'd love to receive your application even if you think you're only a partial match. We are looking to build teams that innovate, not just tick boxes on a job spec.

You will join of one of the most innovative startups in France at an early stage, to be part of a passionate and friendly team on its mission to build the first universal quantum computer!

We love to share and learn from one another, so you will be certain to innovate, develop new ideas, and have the space to grow.