Senior Solution Scientist, Photonics and Quantum Chip Integration and Packaging

VTT; Oulu; On-site; EUR 70,000 - 110,000; Full time

Job summary

VTT in Oulu is seeking a Senior Solution Scientist to join the Photonics and RF Integration team, advancing integration and packaging of photonic, quantum and microelectronic devices. You will plan and carry out research, guide prototyping and pilot manufacturing, interact with customers and partners, and lead R&D projects.

The role bridges academic and industrial research, requiring a doctoral or master's degree and fluent English.

Qualifications

• Doctoral degree or Master’s with substantial relevant work experience in photonics, electronics, quantum technology or related field.
• Experience leading R&D projects and collaborating with customers, research partners and funding networks.
• Fluent in English (written and spoken).

Responsibilities

• Lead and contribute to R&D on integration technologies for novel devices, working with design and manufacturing experts.
• Build customer and research-partner collaboration and contribute to research funding applications.
• Prepare new research and customer projects and lead contracts and publicly funded R&D projects
• Plan and implement characterisation and testing campaigns for fabricated devices and analyse the results with your colleagues.
• Guide prototyping and pilot manufacturing activities.
• Communicate work plans and research results in project meetings, written reports and presentations.
• Disseminate research results through scientific papers, conference presentations and other publications and events.
• Lead small and potentially larger R&D projects, depending on your experience and interests.

Skills

Photonic device integration

Project leadership

English communication

Education

Doctoral degree or Master’s with relevant experience

Tools

Cleanroom packaging

Job description

Are you interested in innovative photonic, quantum and microelectronic devices and looking for a new opportunity in the field? Would you like to work at the interface of academia and industry, developing novel manufacturing technologies for future connectivity, computing, sensing and AI systems? Are you enthusiastic about fascinating projects in state-of-the-art research facilities? VTT might be just the place for you.

We are now looking for a Senior Solution Scientist to join our Photonics and RF Integration team in Oulu.

In this role, you will advance and apply our integration and packaging expertise in the development of photonic, quantum and microelectronic devices. You will plan and carry out research, guide prototyping and pilot manufacturing, communicate with customers and research partners, contribute to research funding applications, and lead customer and publicly funded R&D projects.

Our Photonics and RF Integration team builds functional components and modules from bare-die devices using advanced electronics and photonics assembly and packaging processes in our cleanroom facility in Oulu. Together with colleagues across VTT, the team combines expertise in optics, optoelectronics, high-frequency electronics, system-in-package integration, high-precision assembly and thermal management to create solutions for communications, defence, space, medical and quantum technology applications.

As a Senior Solution Scientist, you will:

• Lead and contribute to R&D on integration technologies for novel devices, working with design and manufacturing experts and advancing our pilot manufacturing capabilities.
• Build customer and research-partner collaboration and contribute to research funding applications.
• Prepare new research and customer projects and lead customer contracts and publicly funded R&D projects
• Plan and implement characterisation and testing campaigns for fabricated devices and analyse the results with your colleagues.
• Guide prototyping and pilot manufacturing activities.
• Communicate work plans and research results in project meetings, written reports and presentations.
• Disseminate research results through scientific papers, conference presentations and other publications and events..
• Lead small and potentially larger R&D projects, depending on your experience and interests.

Who we are looking for:

• You have substantial experience in photonic devices and their integration technologies.
• Experience in assembly and packaging processes, high-frequency electronics or quantum technologies is highly valued.
• Knowledge of electronics manufacturing, integrated circuits, semiconductors, optoelectronics, microsystems, thermal management, mechanical design, failure analysis, materials science, metrology, cleanroom processes, communications technologies or project management is considered an asset.
• You have a doctoral degree, or a master’s degree with substantial relevant work experience, in photonics, electronics, quantum technology, physics or another relevant discipline.
• You have experience in leading R&D projects and collaborating with customers, research partners and funding networks.
• You communicate fluently in English.

As a person, we hope that you are:

• A fast learner who works in a goal-oriented and independent manner while collaborating with colleagues who have complementary expertise.
• Open-minded, curious and eager to explore new topics and find beyond-the-obvious solutions.
• Comfortable with uncertainty and unexpected outcomes in research and development.
• Application-oriented, with an interest in the commercial use of research results and customer satisfaction.
• A flexible and communicative team player who works effectively with customers and research partners and contributes to a positive team spirit.

Interested and want to know more?

For further information, please contact Research Team Leader Mikko Karppinen ([e-mail])

We look forward to hearing from you!

Role context:

This role exists to bridge research-level physical device concepts and scalable microelectronics packaging workflows. Operating within applied research environments, senior technical specialists in this domain translate bare-die semiconductor and optical components into integrated physical modules. Positioned between foundational design teams, external partners, and pilot manufacturing operations, the position oversees physical assembly, high-frequency signal routing, and device characterization. By standardizing packaging techniques and pilot production methods, this function ensures experimental components achieve structural reliability and functional performance required for broader deployment.

Quantum ecosystem relevance:

The role supports the quantum sector by facilitating physical hardware integration, signal routing, and packaging for optical and microelectronic components. As quantum architectures scale, housing delicate chips and maintaining signal fidelity within robust modules becomes crucial. Operating within enabling hardware infrastructure, this position aids the transition of photonic and quantum device prototypes from laboratory testing into structured pilot production workflows. This technical bridge accelerates the realization of physical hardware systems necessary for quantum computing, optical sensing, and communication applications.

Capability signals:

• Advanced background in photonic device integration and semiconductor packaging methodologies
• Expertise in coordinating cleanroom microelectronics assembly and thermal management processes
• Demonstrated capability directing multidisciplinary research and development technical initiatives
• Track record in managing collaborative customer and public funding framework projects
• Experience conducting systematic physical device testing and optical characterization campaigns

Location: Oulu