Senior Process Engineer — Advanced Film Deposition (R&D)

ASM International; Helsinki; Hybrid; EUR 55,000 - 75,000; Full time

Job summary

ASM International in Helsinki is seeking a Senior Engineer for their Global R&D Process Engineering Program. This role focuses on developing cutting-edge semiconductor technologies and offers an 18-24 month comprehensive training phase.

Post-training, opportunities exist to relocate to R&D centers in Japan or the US. Ideal candidates will have a PhD and relevant experience in process engineering and materials characterization techniques.

ASM values diversity and inclusion, making it a great place to advance your career while contributing to impactful technologies.

Qualifications

• 0‑7+ years of combined education, research, and work experience in related fields.
• Experience with thin film deposition techniques like ALD, CVD, PECVD.
• Training in computational fluid dynamics (CFD) is preferred.

Responsibilities

• Develop next-generation semiconductor technologies using ASM's processing equipment.
• Research, develop, and optimize unit processes for metal and dielectric film deposition.
• Write technical papers on advanced process applications and drive problem-solving.

Skills

Project management

Problem solving

Materials characterization

Communication skills

Education

PhD in Chemical Engineering, Materials Science, Electrical Engineering, or Physics

Tools

XPS

SIMS

RBS

AFM

XRD

TEM

SEM

Ellipsometry

Job description

ASM International in Helsinki is seeking a Senior Engineer for their Global R&D Process Engineering Program. This role focuses on developing cutting-edge semiconductor technologies and offers an 18-24 month comprehensive training phase.

Post-training, opportunities exist to relocate to R&D centers in Japan or the US. Ideal candidates will have a PhD and relevant experience in process engineering and materials characterization techniques.

ASM values diversity and inclusion, making it a great place to advance your career while contributing to impactful technologies.