Senior Engineer, Process Engineering | Global R&D Process Engineering Program

ASM International; Helsinki; On-site; EUR 55,000 - 75,000; Full time

Job summary

ASM International in Helsinki is seeking a Senior Engineer for their Global R&D Process Engineering Program. This role focuses on developing cutting-edge semiconductor technologies and offers an 18-24 month comprehensive training phase.

Post-training, opportunities exist to relocate to R&D centers in Japan or the US. Ideal candidates will have a PhD and relevant experience in process engineering and materials characterization techniques.

ASM values diversity and inclusion, making it a great place to advance your career while contributing to impactful technologies.

Qualifications

• 0‑7+ years of combined education, research, and work experience in related fields.
• Experience with thin film deposition techniques like ALD, CVD, PECVD.
• Training in computational fluid dynamics (CFD) is preferred.

Responsibilities

• Develop next-generation semiconductor technologies using ASM's processing equipment.
• Research, develop, and optimize unit processes for metal and dielectric film deposition.
• Write technical papers on advanced process applications and drive problem-solving.

Skills

Project management

Problem solving

Materials characterization

Communication skills

Education

PhD in Chemical Engineering, Materials Science, Electrical Engineering, or Physics

Tools

XPS

SIMS

RBS

AFM

XRD

TEM

SEM

Ellipsometry

Job description

Senior Engineer, Process Engineering | Global R&D Process Engineering Program

Step into a career with ASM, where cutting edge technology meets collaborative culture.

For over 55 years ASM has been ahead of what’s next, at the forefront of innovation and what’s technologically possible. With more than 4,500 ASMers representing 70 nationalities, our people and our advanced semiconductor devices are playing a crucial role in trends such as 5G, cloud computing, AI, and autonomous driving. But we’re more than just a tech company. We value diversity, inclusion and sustainability as we strive to make a positive impact on the world. Our development programs help support your growth, shaping your future and pushing the boundaries of innovation to unleash potential.

Senior Engineer, Process Engineering | Global R&D Process Engineering Program

As a Senior Engineer, Process Engineering within ASM’s Global R&D Process Engineering Program, you will develop next‑generation semiconductor technologies. For the first 18 to 24 months, you will onboard into a comprehensive development program, combining structured learning with hands‑on work using ASM’s world‑leading semiconductor processing equipment. This phase is designed to accelerate technical depth, process mastery, and integration into ASM’s global R&D community.

Following the initial 18 to 24 months in the Global R&D Process Engineering Program, you will relocate to one of ASM’s state‑of‑the‑art R&D centers in Japan, Korea, or the United States (Arizona) for a permanent role. You will apply the technical depth and process expertise you have developed to advance new technologies at the core of one of ASM’s key business units, working closely with leading scientists, engineers, and product teams to translate innovation into industrial impact.

Take a closer look at the role:

• Work with semiconductor processing equipment to research, develop and optimize unit processes focused on the deposition of metal and dielectric films via ALD, PEALD, Epitaxy, and/or PECVD.
• Develop innovative ideas, staying abreast of state‑of‑the‑art processing applications in the semiconductor industry to be effective.
• Process consulting, including writing technical papers on advanced process applications and Intellectual Property creation.
• Participate in and drive technical problem‑solving sessions using the related scientific method and industry tools, such as Ishikawa diagrams.
• Design and conduct experiments, in addition to measuring and interpreting experimental output, aimed at fulfilling stated objectives using Design of Experiments (DOE) and Response Surface Methodology (RSM).
• Troubleshoot equipment problems and is personally and actively engaged in problem via “hands‑on” modalities.
• Work directly customers and central marketing to understand and define requirements to successfully execute and document customer demonstrations.
• Develop methods and techniques for integrating metal and/or oxide films into existing and future device technologies.
• Ensure successful product transfer to customer base by performing demonstrations, traveling to support customer sites (up to 10% travel required), and drafting documentation regarding process development, tool operation and maintenance.
• Produce technical papers on process, equipment, and device integration improvement strategies and present to professional audience.

Qualifications

• PhD degree in Chemical Engineering, Materials Science, Electrical Engineering, or Physics.
• 0‑7+ years of combined education, research, and work experience with:
• Cure, oxidation, ALD, CVD, Epitaxy, PECVD and/or other thin film deposition.
• Materials characterization techniques such as XPS, SIMS, RBS, AFM, XRR, XRD, TEM, SEM and ellipsometry.
• Knowledge of electrical characterization techniques for CMOS devices.
• Application of dielectric and/or metal films for logic and memory structures.
• Training in CFD (computational fluid dynamics), either theoretical or practical is preferred.
• Knowledge of electrical characterization techniques for CMOS devices is preferred.

Skills

• Able to independently manage complex process development projects.
• Creative problem solving with experience in developing new films for emerging applications and experience in chemistry/materials characterization.
• Understand interplay between hardware design (e.g., chemical reactor design) and operation and process outputs.
• Understand of requirements for integration of metals as work function materials and barrier layers in FEOL and BEOL process flows.
• Demonstrated ability to develop and completely characterize deposition processes using first principles and experimental design techniques (e.g., DOE, RSM).
• Experience with the theory, practice, and interpretation of materials characterization techniques such as XPS, SIMS, RBS, AFM, XRD, HRTEM, FESEM, Auger, Raman and ellipsometry.
• Excellent verbal and written communication skills, with ability to clearly communicate advanced technical constructs.

Work Location & Transfer Requirements

For your first 18‑24 months, you’ll complete your training at one of our flagship process development hubs in Leuven (Belgium), in or Helsinki (Finland). Upon completion, you will transfer to one of our Key Product Unit (KPU) Process teams for a permanent role in ASM in either:

• Greater Tokyo, Japan
• Phoenix, Arizona, US

We make the tech that enables the chips in devices which improve lives around the world. We do this with an eye to the future, pushing the boundaries of what’s possible through cutting‑edge innovation, and driving the next wave of technological breakthroughs that shape how we live, work, and connect.

ASM is an equal opportunity employer and considers qualified applicants for employment without regard to race, color, religion, age, nationality, social or ethnic origin, sexual orientation, gender, gender identity or expression, marital status, pregnancy, political affiliation, disability, genetic information, veteran status, or any other characteristic protected by law.