Senior Mechanical Engineer

Semidynamics; Barcelona; Hybrid; EUR 75,000 - 120,000; Full time

Benefits offered by this job

Barcelona office 4 days/week

WFH 1 day/week

Work from anywhere 1 week/year

Competitive package

Job summary

Semidynamics in Barcelona is seeking a Senior Mechanical Design Engineer to own the mechanical architecture for a multi-die accelerator package. You will design sockets, retention hardware, sleds and racks, while ensuring load paths, thermal interfaces and tolerances meet performance requirements.

You will collaborate across thermal, PCBA, SI/PI and production teams, driving DFx with ODM/CM partners and validating through to production. Hybrid work arrangement available in Barcelona.

Qualifications

• 8+ years in mechanical design for high-power electronics or data center hardware
• Proven expertise in package-level mechanics: sockets, retention hardware, warpage control
• Strong 3D CAD skills: Creo, NX, SolidWorks with GD&T and tolerance stack-up ownership
• FEA experience for structural, thermal-mechanical and dynamic loads
• Experience coordinating with ODM/CM or tooling vendors for volume production
• Comfortable analyzing interaction between mechanical load, thermal interface and electrical reliability

Responsibilities

• Own mechanical design from package attach to rack rail, socket and retention
• Define bolster plate, stiffener and retention schemes ensuring bond line integrity across warpage and thermal cycling
• Model package and board deflection; set load budget for thermal solutions
• Own sled, chassis, bracket and rail design for serviceability, airflow and cable routing
• Drive DFM and DFA with ODM/CM or tooling vendors
• Run FEA for structural, thermal-mechanical and shock/vibration cases; perform tolerance stack-up analysis and GD&T
• Collaborate with thermal, PCB/SI/PI, mechanical vendors; support builds, bring-up and field returns

Job description

You will own the mechanical design from package attach to rack rail - socket and retention for a multi-die accelerator, the sled and chassis it lives in, and the structures that hold everything within tolerance under load, shock and thermal cycling. Senior IC role: you define the mechanical architecture, not detail someone else's.

What you will work on:

• Socket, lid, stiffener and retention design for a high-power multi-die package
• Sled, chassis and rack-level mechanical architecture for an OCP-style platform
• Cold plate mounting, load distribution and interface pressure control
• Tolerance stack-up across die, package, board, socket and enclosure
• Shock, vibration and structural validation through to production

Responsibilities:

• Package & socket mechanics: Define bolster plate, stiffener and retention schemes that hold bond line and interface pressure across warpage and thermal cycling. Model package and board deflection, and set the load budget the thermal solution designs against.
• System mechanical design: Own sled, chassis, bracket and rail design for serviceability, airflow and cable routing. Drive DFM and DFA with ODM & CM or contract manufacturing partners.
• Analysis: Run FEA for structural, thermal-mechanical, shock and random vibration cases. Own tolerance stack-up analysis and the GD&T that follows from it.
• Cross-functional: Partner with thermal on cold plate interface and flow paths, with PCB and SI/PI on keep-outs and stiffening, and with mechanical and tooling vendors on parts and fixtures. Support build events, bring-up and field returns.

Requirements:

• 8+ years in mechanical design for server, datacentre, networking or comparable high-power electronics
• Proven package-level mechanical work: sockets, retention hardware, stiffeners, warpage and interface pressure
• Strong 3D CAD (Creo, NX, SolidWorks) and GD&T, with real tolerance stack-up ownership
• FEA experience across structural, thermal-mechanical and dynamic load cases
• Experience driving parts through ODM, CM or tooling vendors into volume production
• Comfortable reasoning about the interaction between mechanical load, thermal interface and electrical reliability

Nice to Have:

• 2.5D, interposer or advanced substrate package mechanics
• Liquid-cooled cold plate and manifold mechanical design
• OCP rack and sled standards, ORv3, or comparable hyperscale form factors
• Shock and vibration test design, and correlation of models to test data
• Python or scripting for CAD automation and analysis post-processing

Why Semidynamics?

• Work for one of Europe's most promising deep-tech semiconductor scale-ups.
• Accelerated development path.
• 4 days per week in the Barcelona office (city center), 1 day WFH.
• 1 week of work from everywhere in the world.
• Competitive package.
• A collaborative, technical, and growth-oriented environment that values direct ownership and clear thinking.