Physical Design Lead Engineer

microTECH Global Limited; España; Presencial; Jornada completa

Ventajas ofrecidas por este puesto de trabajo

Flexible work schedules

Competitive pay

Collaborative learning environment

Spanish lessons

Visa sponsorship available

Descripción de la vacante

A leading technology firm in Barcelona is seeking a Physical Design Lead Engineer to oversee the physical implementation of complex SoCs. The ideal candidate will have a Master’s or PhD in a relevant field and a proven track record in managing SoC projects to mass production. This role offers flexible work schedules, competitive pay, and a collaborative environment with growth opportunities. Benefits include candies, coffee, free Spanish lessons, and visa sponsorship if needed.

Formación

• Proven experience with multiple tapeouts of high-performance SoCs or SiPs for mass production.
• Ability to manage complex SoC or SiP projects as a functional manager.
• Experience with multi-chiplet design is a significant advantage.

Responsabilidades

• Lead the physical implementation process of high-complexity SoCs using advanced technology nodes.
• Collaborate with external IP providers, EDA vendors, and silicon/package vendors.
• Coordinate synchronization between chip design, package design, and PCB design teams.
• Participate in team meetings to provide technical guidance on physical design flow.

Conocimientos

Physical Design

Project Management

High-Speed Digital Design

Conflict Management

Educación

Master’s or PhD in Computer Science, Microelectronics, or Physics

Descripción del empleo

Physical Design Lead Engineer

Place: Barcelona, Spain

Permanent

Description

We are hiring! Are you passionate about physical chip design and leading teams through complex challenges? We need you! As a Physical Implementation Lead, you will take ownership of the entire physical implementation process, from physical chip design to chip production and post-silicon validation. You will work with cutting‑edge technology, collaborating closely with external IP providers, EDA vendors, and silicon/package vendors to deliver high‑performance SoCs or SiPs for mass production.

You will ensure efficient synchronization between the chip, package, and PCB design teams to meet product goals and timelines while keeping product managers informed through detailed reporting. In addition, you will participate in technical hands‑on work when needed and moderate operational design discussions to make swift and efficient decisions.

What do we offer? Flexible work schedules, competitive pay, a highly collaborative learning environment, and opportunities for career growth. Come and join us in the beautiful city of Barcelona! Candies, coffee, and free Spanish lessons included! (Visa sponsorship available if required.)

Key Responsibilities

• Lead the physical implementation process of high‑complexity SoCs using advanced technology nodes.
• Collaborate with external IP providers, EDA vendors, and silicon/package vendors for smooth data exchange and communication.
• Coordinate synchronization between chip design, package design, and PCB design teams.
• Ensure compliance with product goals and timelines through efficient project management and reporting.
• Actively participate in team meetings to provide technical guidance on physical design flow, design for test, and EDA tools and methods.
• Moderate design discussions and make decisions quickly and effectively.
• Occasionally perform technical hands‑on tasks to support the team as required.

Requirements

• Master’s or PhD degree in Computer Science, Microelectronics, or Physics.
• Proven experience with multiple tapeouts of high‑performance SoCs or SiPs for mass production, including reliability and yield optimization.
• Demonstrated ability to manage complex SoC or SiP projects as a functional manager.
• Strong background in high‑speed digital design.
• Excellent presentation and conflict management skills.
• Experience with multi‑chiplet design is a significant advantage.

If you would like to learn more, please email [e-mail] directly