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ZEISS Semiconductor Manufacturing Technology in Oberkochen, Germany, is seeking a seasoned project lead to optimize intralogistics and planning for EUV assembly control, focusing on BOM, routing, and material master data. You will guide sub-projects and drive lean improvements while balancing timeline, quality, and cost.
The role requires several years of production, assembly, or logistics experience, strong SAP PP/MM and SAP MES knowledge, and a track record of cross-functional project
Enabler of smaller, more powerful and more energy‑efficient microchips
Working where tomorrow is created.
What is the one component no smartphone can do without? Exactly – the microchip, the heart of every electronically controlled system. Around 80 percent of all microchips worldwide are manufactured using ZEISS technologies. ZEISS is a technology leader in semiconductor manufacturing equipment. With ultra‑precise lithography optics, photomask systems and process control solutions, ZEISS enables the production of ever smaller, more powerful and more energy‑efficient microchips – and, through its innovations, plays a key role in shaping the age of micro‑ and nanoelectronics.
High-tech innovation happens where people, materials, and processes work together seamlessly. This is where you come in: By analyzing existing workflows and driving targeted improvements, you create the foundation for stable and high-performing production processes. Join a team that enables technological innovation through new ideas and sustainable solutions.
You will further develop reporting and production control approaches to enhance transparency, planning quality, and process stability.