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Ignite Next GmbH in Dresden seeks a hardware/architecture engineer to design the next iteration of a 3D in-memory compute chip. You will collaborate with hardware, compiler and ML engineers to optimize ML workloads on capacitive analog in-memory matrix-vector units.
You will design core architecture modules, evaluate performance with software teams, and monitor AI workloads trends to guide future architectures. A strong EE/CS background and hands-on design experience are required.
In this role you'll be responsible to design the next iteration of SEMRON's 3D in-memory compute chip. You will collaborate with a team of hardware, compiler and ML engineers to optimise all aspects of executing ML workloads based on our capacitive analog in-memory matrix-vector multiplication units.