High Speed Data Connector SI/EMC Design Engineer

Aptiv; Wuppertal; Vor Ort; EUR 70.000 - 95.000; Vollzeit

Zusammenfassung

Aptiv is seeking a qualified engineer to drive high-speed data interconnect design focusing on Signal Integrity and EMC. You will work closely with an international product development team to analyze requirements and perform feasibility studies.

Responsibilities include simulations of SI/EMC for connectors, cables and PCBs up to 20 GHz, alignment with measurements, and creating design guidelines. Travel to customers and suppliers may be required.

Qualifikationen

• Master degree in electrical or telecommunications engineering or bachelor degree with relevant experience in cable/device connector development
• At least 3 years of professional experience in high-speed data communication (e.g. in automotive, telecommunication, PCB design)
• Proficient handling of electromagnetic field simulation tools (preferably ANSYS HFSS, optionally CST Microwave Studio or others)
• Substantial theoretical background on electromagnetics and numerical methods
• Knowledge of SI/EMC standards and specifications (e.g. Open Alliance)
• Strong analytical skills
• Willingness to travel (e.g. to customers, suppliers, workgroups, conferences)
• Business fluent English and good German language skills
• Good intercultural skills and team player

Aufgaben

• Guide high speed data interconnect design focusing on SI and EMC with cross-functional teams
• Analyze SI/EMC requirements from RFQs, standards and workgroups
• Perform investigations and feasibility studies for design concepts
• Identify design parameters with critical performance impact
• Assess optimization options considering costs, quality, manufacturability, and constraints
• Run SI/EMC simulations for connectors, cables, and PCBs up to 20 GHz
• Participate in concept reviews, design reviews, DFMEA and DFMEAs
• Compare simulation results with measurements and perform root-cause analysis
• Create SI/EMC design guidelines and train engineers
• Improve and automate methods for modeling, simulation and design using AI-based approaches
• Join work groups and standardization committees such as Open Alliance, MIPI or ASA

Jobbeschreibung

Major Accountabilities

• Guidance of high speed data interconnect design & optimization in terms of Signal Integrity (SI) and Electromagnetic Compatibility (EMC) in close cooperation with the international and interdisciplinary product development team
• Analysis and evaluation of SI/EMC related requirements (from customer RFQs, standards, workgroups etc.)
• Execution of fundamental investigations and feasibility studies for design concepts
• Identification of relevant design parameters, dimensions and tolerances having critical impact on performance
• Determination of potential optimizations considering costs, quality, manufacturability, mechanical and other constraints
• SI and EMC simulations of high speed data connectors, cable assemblies and PCBs in high frequency range (up to 20 GHz and beyond)
• Participation at critical milestones of the product development process (e.g. concept reviews, design reviews, DFM meetings and DFMEAs)
• Alignment of simulation results with SI/EMC measurement results of physical samples and root cause analysis of failures and deviations
• Creation of SI/EMC design guidelines for high speed data connectors, cable assemblies and PCBs and provide trainings for product and application engineers
• Improvement and automation of methods and procedures for the characterization, modeling, simulation, analysis and design of interconnections considering artificial intelligence based approaches
• Participation in work groups and standardization committees such as Open Alliance, MIPI or ASA

Qualifications: Essential Skills

• Master degree in electrical or telecommunications engineering or bachelor degree with relevant experience in cable/device connector development
• At least 3 years of professional experience in high-speed data communication (e.g. in automotive, telecommunication, PCB design)
• Proficient handling of electromagnetic field simulation tools (preferably ANSYS HFSS, optionally CST Microwave Studio or others)
• Substantial theoretical background on electromagnetics and numerical methodszu
• Knowledge of SI/EMC standards and specifications (e.g. Open Alliance)
• Strong analytical skills
• Willingness to travel (e.g. to customers, suppliers, workgroups, conferences)
• Business fluent English and good German language skills
• Good intercultural skills and team player

Optional Skills

• Experience with RF test equipment for SI and EMC measurements (vector network analyzer, TDR, oscilloscope, tube/triaxial cell etc.)
• Knowledge of PCB design and simulation tools (e.g. Mentor Xpedition, HyperLynx, Spice)
• Knowledge of requirements management tools (e.g. Polarion, Doors)
• Experience in programming/scripting languages (e.g. VBA, Python)

Company Information

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Aptiv is an equal employment opportunity employer. All qualified applicants will receive consideration for employment without regard to race, color, religion, national origin, sex, gender identity, sexual orientation, disability status, protected veteran status or any other characteristic protected by law.

Aptiv is a global technology company that develops safer, greener and more connected solutions enabling the future of mobility. Headquartered in Dublin, Aptiv has approximately 180,000+ employees and operates 12 technical centers, as well as manufacturing sites and customer support centers in 44 countries.

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