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Bosch Sensortec GmbH in Dresden seeks a Development and Integration Engineer to help extend MEMS and ASIC BEOL technology to 300 mm wafer scale. You will lead integration efforts, coordinate interfaces across development and manufacturing, and push new sensor processes from concept to series production.
The role requires several years of relevant experience in sensor, micromechanics or semiconductor technology, with strong English and German language skills and a university-level engineering or
Bosch Sensortec GmbH is a technology leader in sensing solutions based on microelectromechanical systems (MEMS) and dedicated to the consumer electronics world. We develop and market key technologies for smartphones and tablets, hearables, wearables, smartglasses, augmented and virtual reality applications, gaming devices and many more. Our sensors improve people’s well-being and lifestyle and enable consumer electronic devices to sense the world around us. MEMS sensors are therefore an essential part of the foundation for a connected world. Bosch Sensortec GmbH is a wholly owned subsidiary of Robert Bosch GmbH.
To strengthen our leading market position within the sensor products we will extend our MEMS and ASIC BEOL technology to 300 mm wafer. We are looking for a curious and technology-driven engineer (f/m/div.), who has a passion for technology and process. If you enjoy connecting the dots between different technologies, challenging technical boundaries, and turning complexity into manufacturable solutions, this role is for you.
We offer flexible working models: from various part-time options to mobile working and job sharing.
Diversity and inclusion are not just trends for us but are firmly anchored in our corporate culture. Therefore, we welcome all applications, regardless of gender, age, disability, religion, ethnic origin or sexual identity.