Advanced Packaging Electrical / Signal Integrity Architect (f/m/d)

Black Semiconductor GmbH; Aachen; Vor Ort; EUR 90.000 - 130.000; Vollzeit

Zusammenfassung

Black Semiconductor GmbH in Aachen seeks an Advanced Packaging Electrical / Signal Integrity Architect to own electrical characterization and co-design of advanced packages. You will drive package-level signoff, develop RLGC models, and collaborate with ASIC/SerDes teams to meet electrical targets.

You will build and validate models against measurements, support chip-package-board co-simulation, and work with OSAT/Foundry partners to ensure manufacturability and DFMA compliance.

Qualifikationen

• Bachelor's or Master's degree in Electrical Engineering, Electronics Engineering, Physics, or a related field, or equivalent experience.
• 6+ years of experience in package or PCB signal integrity, power integrity, high-speed interconnect design, advanced packaging, or closely related hardware engineering roles.
• Strong expertise in transmission line theory, electromagnetics, S-parameters, channel modeling, package equivalent electrical model development, and signal/power integrity analysis.
• Hands-on experience with SI/PI simulation and modeling tools such as Ansys HFSS/SIwave, Cadence Sigrity, Keysight ADS, HSPICE, or equivalent.
• Experience developing, validating, and correlating simulation models with laboratory measurements using VNA, TDR, high-speed oscilloscopes, or similar instrumentation.
• Working knowledge of advanced packaging technologies including 2.5D/3D integration, interposers, fan-out packaging, chiplets, and high-density substrates.
• Experience with scripting and automation using Python, Perl, Tcl, Cadence SKILL, or similar languages for simulation workflows, data processing, and analysis will be considered a plus.
• Experience with OSAT partners on package electrical qualification, advanced package manufacturing, or design-for-manufacturing (DFM) activities will be considered a plus.
• Experience with electrical/optical co-packaging (EIC-to-PIC interfaces and bump-map signoff), UCIe-class high-speed interconnects, or participation in industry standards organizations such as IEEE, OIF, or JEDEC will be considered a plus.

Aufgaben

• Own the electrical characterization and signoff of advanced semiconductor packages, including package equivalent circuit modeling, signal integrity (SI), power integrity (PI), crosstalk, and EMI/EMC analysis.
• Develop and validate package-level electrical models (RLGC-equivalent circuits, S-parameters) for 2.5D/3D, interposer, fan-out, and chiplet-based package architectures while performing signal integrity analysis across die-package-board interfaces for high-speed SerDes, HBM, and die-to-die interconnects.
• Define package stack-ups, substrate routing guidelines, via strategies, and bump-map/ball-out architectures from an electrical performance perspective, partnering closely with the Advanced Packaging Architect and ASIC teams to balance electrical, mechanical, thermal, manufacturing, and reliability requirements.
• Build, validate, and correlate simulation models using industry-standard SI/PI and electromagnetic tools against laboratory measurements to support package electrical signoff and end-to-end channel performance.
• Support chip-package-board co-simulation and end-to-end channel budgeting in collaboration with ASIC, SerDes, and system engineering teams.
• Collaborate with OSAT and foundry partners throughout package development, qualification, and manufacturing to ensure robust electrical performance, manufacturability, and design-for-manufacturing (DFM) compliance.

Kenntnisse

Signal integrity

Power integrity

High-speed interconnects

Package co-design

Python scripting

Ausbildung

Bachelor's or Master's in Electrical Engineering, Physics, or related

Tools

HFSS

SIwave

Sigrity

HSPICE

ADS

Jobbeschreibung

About us

We see the semiconductor industry as a realm of possibility. We see opportunity. We see the profound impact that our graphene solutions will have in transforming the industry. We invite you to join us in driving change with our fundamentally human-centered approach, uniting bright minds around a shared vision. The vision is: Prove to everybody that you can make a fundamental change. Prove with your knowledge and skills how things can be done differently. Together, we can change the paradigm of how the world connects

About our technology

The semiconductor industry’s growing demand for more powerful chips with higher bandwidth and lower power finds its solution in our technology. We connect chips to high-throughput, low-delay computing networks. The key lies in harnessing the physical properties of graphene to combine electronic computing with photonic communication, allowing countless chips to interact almost as if they were one. Our graphene photonic innovation increases computing power and efficiency to a new order of magnitude. In short, we connect chips to create powerful and energy-efficient networks, overcoming connectivity limitations in the semiconductor industry. We deliver the graphene solution

The Role

We are seeking a skilled Advanced Packaging Electrical / Signal Integrity Architect at Black Semiconductor to own the electrical characterization and co-design of our advanced packages. You will drive package-level electrical signoff by developing equivalent circuit models, leading signal and power integrity analysis, and translating high-speed interconnect requirements into optimized package architectures. Working closely with ASIC/SerDes designers, the Advanced Packaging Architect, and system teams, you will ensure our package designs meet demanding electrical performance targets while enabling Black Semiconductor's next-generation chiplet and advanced packaging technologies.

This role bridges advanced packaging, high-speed electrical design, and simulation-driven package co-design.

To join our team, you should be excited to

• Own the electrical characterization and signoff of advanced semiconductor packages, including package equivalent circuit modeling, signal integrity (SI), power integrity (PI), crosstalk, and EMI/EMC analysis.
• Develop and validate package-level electrical models (RLGC-equivalent circuits, S-parameters) for 2.5D/3D, interposer, fan-out, and chiplet-based package architectures while performing signal integrity analysis across die-package-board interfaces for high-speed SerDes, HBM, and die-to-die interconnects.
• Define package stack-ups, substrate routing guidelines, via strategies, and bump-map/ball-out architectures from an electrical performance perspective, partnering closely with the Advanced Packaging Architect and ASIC teams to balance electrical, mechanical, thermal, manufacturing, and reliability requirements.
• Build, validate, and correlate simulation models using industry-standard SI/PI and electromagnetic tools against laboratory measurements to support package electrical signoff and end-to-end channel performance.
• Support chip-package-board co-simulation and end-to-end channel budgeting in collaboration with ASIC, SerDes, and system engineering teams.
• Collaborate with OSAT and foundry partners throughout package development, qualification, and manufacturing to ensure robust electrical performance, manufacturability, and design-for-manufacturing (DFM) compliance.

Your Qualifications

• Bachelor's or Master's degree in Electrical Engineering, Electronics Engineering, Physics, or a related technical field, or equivalent experience.
• 6+ years of experience in package or PCB signal integrity, power integrity, high-speed interconnect design, advanced packaging, or closely related hardware engineering roles.
• Strong expertise in transmission line theory, electromagnetics, S-parameters, channel modeling, package equivalent electrical model development, and signal/power integrity analysis.
• Hands‑on experience with SI/PI simulation and modeling tools such as Ansys HFSS/SIwave, Cadence Sigrity, Keysight ADS, HSPICE, or equivalent.
• Experience developing, validating, and correlating simulation models with laboratory measurements using VNA, TDR, high-speed oscilloscopes, or similar instrumentation.
• Working knowledge of advanced packaging technologies including 2.5D/3D integration, interposers, fan‑out packaging, chiplets, and high‑density substrates, with the ability to collaborate across ASIC, SerDes, package, mechanical, thermal, and manufacturing engineering teams.
• Experience with scripting and automation using Python, Perl, Tcl, Cadence SKILL, or similar languages for simulation workflows, data processing, and analysis will be considered a plus.
• Experience working with OSAT partners on package electrical qualification, advanced package manufacturing, or design‑for‑manufacturing (DFM) activities will be considered a plus.
• Experience with electrical/optical co-packaging (EIC-to-PIC interfaces and bump-map signoff), UCIe-class high-speed interconnects, or participation in industry standards organizations such as IEEE, OIF, or JEDEC will be considered a plus.

Our work culture

People Over Processes. At Black Semiconductor, flexibility is key—we ensure work adapts to life, not the other way around. We champion work-life harmony, where careers are meaningful and enriching. Our processes are human-centric, allowing you to focus on what matters.

Let’s grow together. Your potential is our priority. We provide the autonomy to make a lasting impact and nurture your growth through a culture of continuous learning. We invest in your journey for professional and personal development.

Your Health and Future Matter. Your well-being is paramount. We offer a comprehensive benefits package with outstanding insurance, pension and virtual stock options for your mental, physical, and financial health. Your peace of mind is our priority - in the present and future.

We Live Openness. Collaboration and inclusivity are the cornerstones of our culture. We practice openness, fostering trust and respect. Individuality is our collective strength, fueling innovation and driving us forward.

We connect chips – and people. We encourage qualified individuals from any background to apply. We foster an inclusive and supportive work environment that values collaboration, innovation, and growth. Join our team and be part of an organization dedicated to making a difference in the industry.

If your application results in an employment relationship, your Applicant Data will be transferred to our personnel records and processed in accordance with applicable legal requirements; otherwise, your Applicant Data will be retained for up to six (6) months after completion of the recruitment process. Read more about our privacy policy here.