3D IC Solutions Engineer - Package Design Engineer - EDA

Siemens Mobility; München; Hybrid; EUR 90.000 - 130.000; Vollzeit

Zusammenfassung

A global technology leader in Electronic Design Automation is seeking a senior package design lead for its 3D IC Solutions Engineering team. You'll develop and validate workflows for advanced 3D IC designs and integrate key EDA tools. The candidate should hold a BS or MS in Electrical/Computer Engineering and have extensive knowledge of advanced packaging EDA tools. This role offers flexibility in work location along with comprehensive employee benefits.

Leistungen

Great benefits and rewards

Flexible working options

Qualifikationen

• Experience with 2.5D and 3D solutions.
• Knowledge of EDA data formats.
• Scripting knowledge in Python or similar languages.

Aufgaben

• Drive development of workflows for 3D IC physical design.
• Integrate 3D IC workflows into the physical design workflow.
• Provide technical support to sales and marketing.

Kenntnisse

Advanced Packaging IC EDA tools

Python

Signal/Power integrity analysis

Ausbildung

BS or MS in Electrical/Computer Engineering

Tools

Siemens (HyperLynx SI/PI)

Ansys (Redhawk, Totem)

Cadence (Sigrity, Clarity)

Jobbeschreibung

489807

22-Dic-2025

Research & Development

Siemens Electronic Design Automation GmbH

Siemens EDA is a global technology leader in Electronic Design Automation products and systems. Our portfolio enables companies around the world to develop new and highly innovative electronic products faster and more cost-effectively. Our customers use our solutions to push the boundaries of technology and physics to deliver better products in the increasingly complex world of chip, board and system design.

Siemens EDA is seeking a senior level, self-starting, motivated, and high performing individual for an opportunity to serve as the package design lead in our 3D IC Solutions Engineering team in driving the development of comprehensive, end to end workflow solutions supporting the development of advanced 2.5 and 3D System in Package (SIP) designs. These multi-domain workflow solutions seamlessly integrate Siemens’ industry leading EDA and MCAD tools that facilitate the architectural planning, physical design /verification, muti-die based electrical, thermal, mechanical stress analysis and manufacturing test of advanced 2.5 and 3D System-in-Package (SIP) designs.

Responsibilities

The primary responsibility for this position will be to drive the development of workflows to support the physical design planning, layout, and verification of advanced 3D IC designs. These workflows include package floor planning, package/ chiplet level functional/ IO planning, interposer/substrate planning, layout, package level connectivity, Logical Equivalence Checking (LEC), package level 3D stack (DRC/LVS) verification and physical DRC/DFM verification of the package components (excluding the chiplet devices). Additional responsibilities include working with the 3D IC Solutions teams in integrating the other 3D IC workflows into the 3D IC Physical Design workflow.

Reference designs and test structures and/or customer designs will be used in the development, testing and validation of these workflows. The package design lead will also provide technical support and guidance to the sales, marketing design service organizations as required.

This position may require periodic travel to work with customers in developing and validating these workflow solutions.

Requirements

BS or MS in Electrical/Computer Engineering - or equivalent

Working knowledge (experience preferred) of Advanced Packaging IC EDA tools and design methods including :

2.5D and 3D solutions (Si Interposer, FOWLP Package and Interposer, Organic Package)

Package Design Cadence (APD/ SiP ), Siemens (XSI/XPD)

Signal/Power integrity analysis: Siemens (HyperLynx SI/PI), Ansys ( Redhawk, Totem, Swave ), Cadence ( Sigrity, Clarity )

Detailed knowledge of EDA data formats (Verilog, LEF/DEF, GDS, OASIS, etc.).

Working OS knowledge of Windows and Linux

Scripting/Programming: Python, Tcl, Perl, or similar languages required; Tk based GUI development is a plus.

Working knowledge of IC EDA tools and design methods including :

ASIC design methodology from RTL Synthesis to Physical Implementation phases

RTL Design /Verification, LEC, STA analysis

Integration and validation of Silicon-on-Chip IP integration and validation

Place and Route solutions: Siemens (Aprisa, Nitro, Tanner), Synopsys (IC/3DIC/Custom Compiler), Cadence (SoC Encounter, Innovus, Virtuoso)

Physical Verification: DRC, LVS, IR/EM analysis

DFT integration and ATE test support.

Working knowledge of Thermal/Stress analysis and/or optical design tools and design methods a plus, including:

Thermal and/or mechanical stress analysis tools: Siemens (NX, Flowtherm, SimCenter 3D), Ansys ( Icepak, Mechanical), Cadence (Celsius)

Working competency with Microsoft Word, Excel, and PowerPoint.

Why us?

Working at Siemens Software means flexibility – choosing between working at home or in the office is the norm here. We offer great benefits and rewards, as you'd expect from a world leader in industrial software.

Siemens Industry Software is an equal opportunities employer and does not discriminate unlawfully on the grounds of age, disability, gender assignment, marriage, and civil partnership, pregnancy and parental, race, religion or belief, sex, sexual orientation, or trade union membership.