Structure and thermal analysis Interno-Op/Intern/Trainee

Dana; Boucherville; On-site; CAD 28,000 - 36,000; Part time

Benefits offered by this job

Job summary

Dana is seeking a Structure and Thermal Analysis Intern/Trainee in Mechanical Engineering to support fatigue prediction in PCB components and thermal indexing for motor design.

As part of a multidisciplinary team, you will perform FE analyses, study thermal indexes, and collaborate with electromagnetic engineers to enhance 1D analysis tools. Fluent in French and English is required. Join our team of 28,000 problem solvers who drive innovation worldwide.

Qualifications

• Knowledge of FE analysis and related software tools.
• Knowledge of thermal analysis and related software tools.
• Strong critical thinking applied to mechanical systems.
• Proactive multidisciplinary teamwork and communication.

Responsibilities

• Perform finite element analyses to evaluate the structural response of PCB assemblies and electronic components under random vibration environments.
• Carry out correlation studies between FE models and experimental results.
• Define and document modelling practices and recommendations for assessing vibration-induced fatigue risk.
• Study existing 1D thermal analysis of steady state motor cooling, post-process data to generate a thermal index.
• Compile thermal indexes and perform parametric analysis relating the index to motor geometry.
• Collaborate with the electromagnetic team to improve 1D analysis software to include the new index.

Skills

Finite element analysis

Thermal analysis

Critical thinking

Team collaboration

Bilingual (French/English)

Education

Bachelor’s (4th year) or Master’s student in Mechanical Engineering

Tools

ANSYS

Thermal analysis software

Job description

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Structure and thermal analysis Interno-Op/Intern/Trainee

Requisition: 68405

Job Duties and Responsibilities

• Structural topic (approximately 70%): improve the understanding and prediction of fatigue in printed circuit board (PCB) electronic components subjected to random vibration loading.
  
  • Perform finite element analyses to evaluate the structural response of PCB assemblies and electronic components under random vibration environments.
  • Carry out correlation studies between finite element models and experimental results.
  • Define and document relevant modelling practices, indicators, and recommendations for assessing vibration-induced fatigue risk in electronic components.
• Thermal topic (approximately 30%):
  • Study existing water-cooled motor electromagnetic 1D thermal analysis of steady state performance previously performed, and post-process the loss data to generate a thermal index.
  • Compile all the different motor thermal indexes and perform a parametric analysis to relate the index to the motor geometry.
  • Work with the electromagnetic team to improve their 1D analysis software to include a new option to use this thermal index to evaluate thermally limited performance for new designs based on motor geometry.

Education and Qualifications

Bachelor’s (fourth year) or Master’s student in Mechanical Engineering

Skills

• Knowledge of finite element (FE) analysis and related software tools
• Knowledge of thermal analysis and related software tools
• Strong critical thinking skills applied to mechanical systems and root‑cause analysis
• Proactive mindset with the ability to work and communicate effectively in a multidisciplinary team
• Understanding of electric motor fundamentals (considered an asset)
• Fluency in French and English, both written and spoken

Join our team of 28,000 problem solvers who are fostering a culture of innovation by leveraging the diverse perspectives of our global team. We believe in facing challenges head-on by finding opportunity and uncovering possibility, where roadblocks and barriers become targets instead of obstacles. We are One Dana with limitless opportunity.