Staff Hardware Design Engineer - Application Engineering

QUALCOMM, Inc.

Ottawa

On-site

CAD 171,000 - 242,000

Full time

14 days+

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Job summary

Qualcomm Canada ULC is seeking a Staff Hardware Design Engineer to join our Application Engineering team in Ottawa. The role focuses on designing, validating, and supporting evaluation platforms for 100G/200G/400G PAM4 DSP/optical transceiver systems used in AI and cloud infrastructure.

You will own EVB projects, lead bring-up, and work with customers to ensure successful deployments, while leveraging deep knowledge of signal integrity and power delivery in high-speed designs.

Qualifications

  • Bachelor's degree in Electrical/Electronics Engineering, Computer Science, or related field.
  • 4+ years of Hardware Engineering experience, or 3+ with master's.
  • PhD in related field with 2+ years.

Responsibilities

  • Own EVB development projects from specification through validation.
  • Lead hardware bring-up and first-power-on activities.
  • Provide hardware expertise to internal teams and customers.
  • Drive signal integrity and power integrity analyses.
  • Support customer integration of DSP products into optical transceivers and AEC platforms.
  • Review customer schematics and PCB layouts.

Skills

High-speed hardware design
PCB design
Signal integrity
Power integrity
EVB bring-up
Schematic capture
SerDes / PAM4

Education

Bachelor's degree in Electrical/Electronics Engineering, Computer Science, or related field
Master's degree in Electrical/Electronics Engineering, or related field
PhD in related field

Tools

HFSS

Job description

Qualcomm Canada ULC is seeking a Staff Hardware Design Engineer to join our Application Engineering team in Ottawa. The role focuses on designing, validating, and supporting evaluation platforms for 100G/200G/400G PAM4 DSP/optical transceiver systems used in AI and cloud infrastructure.

You will own EVB projects, lead bring-up, and work with customers to ensure successful deployments, while leveraging deep knowledge of signal integrity and power delivery in high-speed designs.

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