Packaging Engineer - Optical Attach Process

Xanadu; Toronto; On-site; CAD 110,000 - 140,000; Full time

Benefits offered by this job

Equity

Benefits package

Competitive compensation

Job summary

Xanadu is seeking an Optical Packaging Engineer in Toronto to drive ultra-low-loss fiber-to-chip alignment and packaging processes for scalable, photonic quantum hardware.

The role combines hands-on lab work, tooling development, and cross-functional collaboration to bridge PICs with quantum hardware. A Master's degree and 2+ years in packaging engineering are preferred, with equity and benefits offered.

Qualifications

• Master's degree in Mechanical, Electrical, Photonics, Packaging, Materials Science, or related field.
• Strong understanding of photonic-based on-chip/off-chip systems.
• Experience with optical packaging technologies and equipment.
• Excellent analytical and problem‑solving skills.
• Ability to manage complex projects from conception to completion.
• Effective communication and cross-functional collaboration.
• Proficiency with CAD software and statistical analysis tools.
• Knowledge of electrical and pneumatics systems.

Responsibilities

• Hands-on lab work with alignment equipment and experiments.
• Design and optimize high-precision fiber-to-chip alignment.
• Develop fiber attach tooling and fixtures.
• Collaborate with photonics R&D, mechanical design, packaging, and test engineers.
• Scale designs from prototype to automated production line.

Skills

Analytical thinking

Project management

Communication skills

Team collaboration

Problem solving

Education

Master's degree in Mechanical/Electrical/Photonic/Packaging Engineering or Materials Science

Tools

SolidWorks

AutoCAD

Statistical analysis tools

Packaging equipment (e.g., ficonTEC)

Job description

About Xanadu

Xanadu’s mission is to build quantum computers that are useful and available to people everywhere.

About Xanadu

Xanadu’s mission is to build quantum computers that are useful and available to people everywhere. At Xanadu, we are learners, innovators, researchers, collaborators and problem solvers. We are creating something that has never been built before. What we are doing is extremely hard, the classic moon shot. Few people in their life will be able to be a part of something like this, where if we are successful, the technologies we develop will solve some of the world’s most challenging problems and literally change the world. And that is something to be excited about!

Your Role And Responsibilities

At Xanadu, an Optical Packaging Engineer plays a critical role on the Hardware Team, bridging photonic integrated circuits (PICs) with scalable, fault-tolerant quantum hardware architectures. The primary mission is developing ultra-low-loss, high-precision fiber-to-chip optical attachment processes to enable rack-scale photonic quantum computers.

• Hands-on laboratory work: setting up experiments and operating alignment equipment. Perform minimal changes to the machines during process development.
• Optical Attach & Fiber-to-Chip Alignment: Design, optimize, and characterize high-precision active and passive optical alignment processes to connect fiber arrays, optical connectors, and chiplet structures to photonic integrated circuits with minimal optical loss.
• Process & Tooling Development: Conduct hands‑on optimization of fiber attach tooling and fixtures.
• Cross-Functional Collaboration: Partner with photonics R&D, mechanical design, electrical packaging, and test engineers to build full optoelectronic assemblies.
• Scale engineering designs from functional prototype validation to full-scale, automated assembly line production

Basic Qualifications And Experience

• Master's degree in Mechanical Engineering, Electrical and Electronic Engineering, Photonics Engineering, Packaging Engineering, Materials Science, or a related technical field.
• Basic understanding of photonic-based on-chip and off-chip systems.
• Proven experience with various optical packaging technologies and equipment.
• Excellent analytical and problem‑solving skills.
• Demonstrated ability to manage complex technical projects from conception to completion.
• Good communication, presentation, and interpersonal skills, capable of effectively collaborating with diverse teams and stakeholders.
• Proficiency with CAD software (e.g., SolidWorks, AutoCAD) and statistical analysis tools.
• Good knowledge of electrical and pneumatics systems.

Preferred Qualifications And Experience

• Strong understanding of photonic-based on‑chip and off‑chip systems.
• Experience with automation and robotics in packaging.
• Experience using ficonTEC’s equipment.
• Familiarity with relevant industry standards and regulations.
• Minimum of 2+ years of progressive experience in packaging engineering within a manufacturing environment.

This is for a new position. Your base salary will be determined based on your location, experience, and internal benchmarks. The base salary range is 110,000 - 140,000 CAD. You will also be eligible for equity and benefits.

Our values are important. They are fundamental and lay the foundation for culture at Xanadu. Learn more about our values here.

We are an equal opportunity employer and encourage candidates of all backgrounds to apply. We are committed to building an inclusive, safe, and equitable culture and fostering an environment where our employees feel included, valued, and heard. We are committed to meeting the needs of all individuals and support a barrier‑free workplace. Should you require accommodations at any point during the recruitment process please contact Recruiting at [e-mail].

Please be advised that we may use artificial intelligence (AI) tools to assist in the screening and assessment of applicants for this position. These tools assist our recruitment team but do not replace human judgment. Final hiring decisions are ultimately made by humans. If you would like more information about how your data is processed, please contact us.