Sr. Packaging NPI Engineer

Xanadu; Toronto; On-site; CAD 160,000 - 200,000; Full time

Benefits offered by this job

Equity

Benefits

Job summary

Xanadu is seeking a Senior Packaging NPI Engineer in Toronto to lead the introduction of new packaging processes and equipment, coordinating across R&D, design, manufacturing and supply chain throughout the product lifecycle.

The role requires a Master’s degree in a technical field, 5+ years in packaging engineering with NPI focus, CAD experience, and strong analytical skills. Base salary ranges and equity benefits are offered; on-site work in Toronto.

Qualifications

• Master's degree in Mechanical Engineering or related technical field.
• Minimum 5+ years in packaging engineering with strong NPI focus.
• Experience with various packaging technologies and equipment; FiconTEC a plus.
• Analytical, data-driven decision making and strong communication skills.
• Proficient in CAD software (e.g., SolidWorks, AutoCAD).

Responsibilities

• Lead development, validation and implementation of new packaging processes from concept to high-volume manufacturing.
• Conduct process characterization, optimization and validation for packaging lines and equipment.
• Research, evaluate, select and qualify new packaging equipment and materials.
• Troubleshoot complex packaging process issues during NPI and provide production support.
• Manage multiple NPI projects with timely delivery and adherence to specs.

Education

Master's degree in Mechanical Engineering / related technical field

Tools

FiconTEC equipment

Job description

About Xanadu

Xanadu’s mission is to build quantum computers that are useful and available to people everywhere.

At Xanadu, we are learners, innovators, researchers, collaborators and problem solvers. We are creating something that has never been built before. Few people in their life will be able to be a part of something like this, where if we are successful, the technologies we develop will solve some of the world’s most challenging problems, and literally change the world. And that is something to be excited about!

Your role and responsibilities

We are looking for a highly motivated and experienced Senior Packaging New Product Introduction (NPI) Engineer to join our dedicated engineering team. In this pivotal role, you will lead the successful introduction of new packaging processes and technologies from concept to mass production. This involves collaborating with R&D, design, manufacturing, and supply chain teams across the entire product lifecycle to ensure robust, scalable, and ultra-low-loss packaging solutions. The successful candidate will be working directly with machines as needed throughout the NPI process.

• New Process Development & Implementation: Lead the development, validation, and implementation of new packaging processes and equipment, from initial concept through pilot production to high-volume manufacturing.
• Process Optimization & Validation: Hands‑on conduct comprehensive process characterization, optimization, and validation for new packaging lines and equipment.
• Equipment Selection & Qualification: Research, evaluate, select, and qualify new packaging equipment and materials, staying current with industry trends and advancements.
• Troubleshooting & Problem Solving: Act as a subject matter expert in hands‑on troubleshooting complex packaging process issues during NPI phases and provide ongoing production support.
• Project Management: Manage multiple NPI projects concurrently, ensuring timely delivery and strict adherence to all technical specifications.

Basic qualifications and experience

• Master's degree in Mechanical Engineering, Electrical and Electronic Engineering, Photonics Engineering, Packaging Engineering, Materials Science, or a related technical field.
• Basic understanding of photonic-based on‑chip and off‑chip systems.
• Minimum of 5+ years of progressive experience in packaging engineering, with a strong emphasis on new product introduction (NPI) within a manufacturing environment.
• Proven experience with various packaging technologies and equipment; experience with FiconTEC equipment is highly desired.
• Excellent analytical and problem‑solving skills, with a data‑driven approach to decision‑making.
• Demonstrated ability to manage complex technical projects from conception to completion.
• Exceptional communication, presentation, and interpersonal skills, capable of effectively collaborating with diverse teams and stakeholders.
• Proficiency with CAD software (e.g., SolidWorks, AutoCAD) and statistical analysis tools.

Preferred qualifications and experience

• Strong understanding of photonic-based on‑chip and off‑chip systems.
• Proven experience using advanced die‑to‑carrier, die‑to‑die, and die‑to‑wafer bonding techniques.
• Experience with automation and robotics in packaging.
• Familiarity with relevant industry standards and regulations.

This is for a new position. Your base salary will be determined based on your location, experience, and internal benchmarks. The base salary range is 160,000 - 200,000+ CAD. You will also be eligible for equity and benefits.

Our values are important. They are fundamental and lay the foundation for culture at Xanadu. Learn more about our values here.

We are an equal opportunity employer and encourage candidates of all backgrounds to apply. We are committed to building an inclusive, safe, and equitable culture and fostering an environment where our employees feel included, valued, and heard. We are committed to meeting the needs of all individuals and support a barrier‑free workplace. Should you require accommodations at any point during the recruitment process please contact Recruiting at [e-mail].

Please be advised that we may use artificial intelligence (AI) tools to assist in the screening and assessment of applicants for this position. These tools assist our recruitment team but do not replace human judgment. Final hiring decisions are ultimately made by humans. If you would like more information about how your data is processed, please contact us.