Data Center Infrastructure Engineer

Xanadu; Toronto; Hybrid; CAD 140,000 - 180,000; Full time

Benefits offered by this job

Equity

Benefits

Job summary

Xanadu in Toronto is hiring for a hardware-focused mechanical engineer to own rack-scale packaging and thermal management for quantum computer infrastructure. You will model CDU/ PDU networks, design liquid cooling loops, and ensure robust assemblies across cross‑functional teams.

Ideal candidates bring 5+ years in data center thermal/mechanical systems, strong GD&T, and hands-on experience with CAD/CAM and CFD tools. This role offers equity and a competitive CAD salary package.

Qualifications

• BSc or higher in mechanical engineering or related discipline.
• 5+ years in data center thermal/mechanical systems engineering.
• Proficiency in system-level thermal and hydraulic sizing.
• Hands-on thermal simulations for temperature stability and low vibration.
• GD&T and tolerance stack‑up for complex assemblies.
• Experience with sheet metal, machined components, and chassis packaging.
• Ability to work cross-functionally in a fast-paced environment.
• Strong communication and end-to-end mechanical ownership skills.

Responsibilities

• Model and size rack infrastructure components (CDUs, PDUs, manifolds, liquid loops).
• Own mechanical design of sub-system modules for rack integration.
• Lead packaging of production rack-scale hardware.
• Collaborate with photonic, electrical, optical, and software teams.
• Ensure temperature stability, low vibration, and reliable interfaces.

Skills

Thermal simulations

CFD/FEA

GD&T (ASME Y14.5)

Tolerance stack‑up analysis

Sheet metal design

Machined components

Structural frames

Vibration isolation

Cross‑functional collaboration

Education

BSc in mechanical engineering

MSc in mechanical engineering

Tools

CAD/ CAM software

ANSYS Icepak

SimScale

FloTHERM

Job description

About Xanadu:

Xanadu’s mission is to build quantum computers that are useful and available to people everywhere.

At Xanadu, we are learners, innovators, researchers, collaborators and problem solvers. We are creating something that has never been built before. Few people in their life will be able to be a part of something like this, where if we are successful, the technologies we develop will solve some of the world’s most challenging problems, and literally change the world. And that is something to be excited about!

Your role and responsibilities

As part of the Hardware Team in Toronto, you will take your experience in delivering complex mechanical, vibration-control, and thermal-cooling solutions and apply it to Xanadu’s rack-scale quantum computer development. In this role, you will bridge facility-level infrastructure design with chassis-level mechanical packaging. You will model and size key rack infrastructure (CDUs, PDUs, liquid manifolds, fiber managers) while owning the mechanical design of the sub-system modules that integrate directly into our racks. With your strong background in mechanical design, thermal/liquid management, and complex assemblies, you will take mechanical ownership of the world’s first photonic quantum computers deployed at scale.

Basic qualifications and experience

• BSc or higher in mechanical engineering or a relevant, related discipline.
• 5+ years of industry experience in data center thermal/mechanical systems engineering.
• Proficiency in system-level thermal and hydraulic sizing, including selecting and integrating Cooling Distribution Units (CDUs), Power Distribution Units (PDUs), manifolds, and liquid cooling loops.
• Hands-on experience with thermal simulations (CFD/FEA) to achieve precise temperature stability, uniform heat distribution, and low vibration across both sub-system enclosures and rack-level environments.
• Proficiency in GD&T (ASME Y14.5) and tolerance stack-up analysis for complex assemblies, particularly for blind-mate power and fluid connections.
• Deep familiarity with mechanical packaging (sheet metal design, machined components, structural frames, and quick-disconnect fluid fittings).
• Self-motivated and adaptable, comfortable working both independently and collaboratively with cross-functional teams (photonic, electrical, optical, and software engineers) in a fast-paced environment.
• Strong interpersonal and technical communication skills, with a track record of taking end-to-end mechanical ownership of complex hardware deliverables.

Preferred qualifications and experience

• MSc in mechanical engineering or a relevant, related discipline.
• 8+ years of combined academic and industry experience, including 3+ years leading mechanical packaging or data center infrastructure projects in a commercial industry environment.
• End-to-end experience specifying, sizing, or designing rack-scale infrastructure, including liquid-to-liquid / liquid-to-air Cooling Distribution Units (CDUs), secondary fluid loops, manifolds, and high-density Intelligent PDUs.
• Proven track record in sub-system module packaging, designing complex mechanical assemblies (50+ unique parts) integrating sensitive electronics, high-power compute/optical ICs, or photonic components.
• Hands-on experience with customized rack frameworks compliant with EIA-310, OCP (Open Compute Project), or custom high-density cabinet standards, including structural load analysis and blind-mate mechanical guide systems.
• Advanced thermal and hydraulic modeling expertise, using CAD mesh definitions and CFD tools (e.g., Ansys Icepak, SimScale, FloTHERM) to simulate both chip-level cold plate temperatures and macro-level fluid pressure drops across full rack manifolds.
• Expertise in passive and active vibration mitigation, including structural and acoustic vibration isolation within chassis and interconnect assemblies to protect phase-sensitive optical/photonic paths from pump, fan, or fluid dynamics.
• Expert-level experience with major CAD and CAM software.
• Hands-on experience with industry manufacturing techniques for metallic and plastic parts.
• Hands-on experience with CNC machining and 3D printing to quickly prototype concepts and ideas.
• Experience liaising with machining centers for parts production.
• Experience working in multidisciplinary teams to extract requirements.
• Experience with high-volume sheet metal stamping and forming processes, with a strong understanding of DFM principles.
• An exceptional candidate will have experience specifying or designing production rack-scale electrical power distribution.

This is for a new position. Your base salary will be determined based on your location, experience, and internal benchmarks. The base salary range is 140,000 - 180,000+ CAD. You will also be eligible for equity and benefits.

Our values are important. They are fundamental and lay the foundation for culture at Xanadu. Learn more about our values here.

We are an equal opportunity employer and encourage candidates of all backgrounds to apply. We are committed to building an inclusive, safe, and equitable culture and fostering an environment where our employees feel included, valued, and heard. We are committed to meeting the needs of all individuals and support a barrier-free workplace. Should you require accommodations at any point during the recruitment process please contact Recruiting at [e-mail].

Please be advised that we may use artificial intelligence (AI) tools to assist in the screening and assessment of applicants for this position. These tools assist our recruitment team but do not replace human judgment. Final hiring decisions are ultimately made by humans. If you would like more information about how your data is processed, please contact us.