FPGA Solutions Architect for High-Speed Embedded Systems

Fidus; Ottawa; Sur place; CAD 169 000 - 240 000; Plein temps

Avantages offerts par ce poste

Medical benefits

401(k) plan

Profit sharing

Résumé du poste

Fidus, headquartered in Ottawa, Canada, seeks a Solutions Architect, FPGA to translate client requirements into robust FPGA-based solutions. You will craft architectural paths, estimate work, and highlight risks with mitigation strategies.

You will collaborate across FPGA/DSP, hardware, embedded software, verification, SI/PI, PCB layout, and mechanical/thermal design on high-speed systems for diverse markets.

Qualifications

• Bachelor's degree in Electrical Engineering, Computer Engineering, Computer Science, or the equivalent.
• Seven years of design background in a Senior FPGA Designer role is preferred.
• Expert level RTL design in VHDL and/or SystemVerilog, from architecture through timing closure.
• Hands-on experience with AMD and/or Altera device families and toolchains.

Responsabilités

• Understand client needs and develop requirements.
• Architect a solution meeting client needs.
• Plan, identify risks and mitigation strategies, and estimate work.
• Write technical content for proposals.
• Present Fidus resource capabilities and approach.
• Discuss and refine work approach and estimates.
• Partition programs into logical segments.
• Undertake project work as required.
• Identify new Fidus products and areas for R&D.

Connaissances

RTL design

SystemVerilog/UVM

FPGA bring-up

Concise communication

Presentation experience

Travel readiness

Problem solving

Formation

Bachelor’s degree in Electrical/Computer Engineering or CS

Outils

Vivado

Quartus

ModelSim

Description du poste

Fidus, headquartered in Ottawa, Canada, seeks a Solutions Architect, FPGA to translate client requirements into robust FPGA-based solutions. You will craft architectural paths, estimate work, and highlight risks with mitigation strategies.

You will collaborate across FPGA/DSP, hardware, embedded software, verification, SI/PI, PCB layout, and mechanical/thermal design on high-speed systems for diverse markets.