MTS Materials and Surface Analysis - APTD

Micron Technology, Inc.; Região Norte; On-site; BRL 90,000 - 120,000; Full time

Job summary

Micron Technology, Inc. in Brazil seeks a senior materials characterization expert to lead advanced packaging analytics. You will perform material and surface characterization using XPS, XRD/XRR, AFM and related tools, analyze chemistry, crystallography and film properties, and identify failure mechanisms.

The role requires collaboration with Process, Product and Reliability teams, development of BKMs for new materials, and mentoring engineers in data interpretation and reporting.

Qualifications

• PhD with ≥7 years, or MS with ≥10 years, or BS with ≥15 years in a materials-related field.
• Experience in semiconductor R&D, technology development, materials characterization, process engineering, or failure analysis.
• Strong hands-on experience with XPS, XRD/XRR, Auger and AFM; data interpretation.

Responsibilities

• Perform materials and surface characterization using XPS, XRD/XRR, AFM, Nanoindentor.
• Analyze surface chemistry, composition, crystallography, and thin-film properties.
• Investigate contamination, corrosion, adhesion, delamination, and interface issues.
• Correlate analytical results with process conditions and reliability results.
• Develop and establish BKMs for new materials and advanced packaging technologies.
• Interpret spectra and depth profiles; integrate multiple techniques to identify failure mechanisms.
• Provide technical conclusions and recommendations to engineering teams.
• Train engineers on analytical techniques and data interpretation.

Skills

XPS

XRD/XRR

AFM

Auger

Data interpretation

Surface chemistry

Education

PhD with ≥7 years, Master with ≥10 years, or Bachelor with ≥15 years in Materials Science, Chemical Engineering, Chemistry, Applied Physics, Electrical Engineering, or related field

Tools

SEM/EDX

FIB

TEM

FTIR

Raman

ToF-SIMS

X-ray imaging

Job description

Key Responsibilities

Materials & Surface Characterization

• Perform materials and surface characterization using XPS, XRD/XRR, AFM, Nanoindentor.

• Analyze surface chemistry, elemental composition, chemical states, crystalline structure, thin-film thickness/density, surface roughness, contamination, oxidation, and interfaces.

• Investigate material-related issues including contamination, corrosion, adhesion, delamination, film non-uniformity, and interface degradation.

• Correlate analytical findings with process conditions, package performance, reliability results, and failure-analysis observations.

• Develop and establish best-known methods (BKMs) for new materials and advanced packaging technologies.

Data Analysis & Root Cause

• Interpret spectra, diffraction data, depth profiles, chemical maps, and nanoscale surface images.

• Integrate results from multiple analytical techniques to determine material and process-related failure mechanisms.

• Provide clear technical conclusions and recommendations to engineering teams.

• Document analytical methods, results, and findings for knowledge sharing and future reference.

Technical Leadership & Collaboration

• Serve as the subject-matter expert (SME) for materials and surface analysis.

• Work cross-functionally with Process, Product, Reliability, Quality, Assembly, and FA teams.

• Train and mentor engineers and laboratory personnel on analytical techniques and data interpretation.

• Engage equipment vendors and industry experts to develop new characterization capabilities supporting the advanced packaging roadmap.

Equipment & Laboratory Management

• Maintain analytical equipment readiness, calibration, preventive maintenance, and measurement quality.

• Work with Global Engineering Labs on equipment troubleshooting, repair, upgrades, and new capability development.

• Maintain laboratory safety, documentation, procedures, and applicable quality/environmental compliance.

AI & Continuous Improvement

• Apply AI-assisted tools to improve data analysis, reporting, knowledge management, and laboratory efficiency.

• Identify and implement AI-enabled or automated improvements in materials-characterization workflows while ensuring responsible use and data integrity.

Minimum Qualifications

• PhD with ≥7 years, Master with ≥10 years, or Bachelor with ≥15 years of relevant experience in Materials Science, Chemical Engineering, Chemistry, Applied Physics, Electrical Engineering, or a related field.

• Experience in semiconductor R&D, technology development, materials characterization, process engineering, or failure analysis.

Required Technical Skills

• Strong hands-on experience with XPS, XRD/XRR, Auger, and/or AFM, with expertise in data interpretation.

• Strong knowledge of surface chemistry, thin films, material interfaces, crystallography, oxidation, contamination, adhesion, and material failure mechanisms.

• Experience with analytical method development, sample preparation, and root-cause investigation.

• Knowledge of semiconductor fabrication, advanced packaging, assembly, or reliability processes.

• Experience with complementary techniques such as SEM/EDX, FIB, TEM, FTIR, Raman, ToF-SIMS, or X-ray imaging is an advantage.

Professional Skills

• Strong analytical and problem-solving skills.

• Excellent technical communication and stakeholder-management skills.

• Ability to work independently and effectively within cross-functional engineering teams.

• Demonstrated ability to translate complex analytical data into actionable engineering recommendations.