MTS, NAND PI

Micron Technology, Inc.; Região Norte; On-site; BRL 658,000 - 877,000; Full time

Job summary

Micron Technology, Inc. seeks a Member of Technical Staff for the NAND Module Process Integration team in Singapore.

You will design, develop, and implement process solutions to improve 3D NAND product yield and quality with competitive cost and performance within timelines. Your responsibilities include leading modules, defining specifications, setting strategic directions, proactively resolving issues, and driving process improvements from research to production.

Qualifications

• PhD, Masters, or Bachelor's in a related field with semiconductor industry experience.
• Proficiency in scripting/programming/analytics software such as Python, Tableau, Power BI is desirable.
• Ability to develop an end-to-end understanding of PI modules on new NAND technologies and related failure mechanisms.
• Experience in R&D and technology transfer within the semiconductor industry is preferred.

Responsibilities

• Lead one or more process modules related to the development and operation of a 3D NAND semiconductor IC.
• Define structural specifications and process requirements for assigned modules.
• Set a clear direction and continual improvement plan for the module.
• Proactively identify and address structural, electrical, and reliability issues with process control.
• Focus on development and optimization of electrical performance, parametric verification, and manufacturability.
• Design and execute device and process experiments; analyze data and report conclusions.
• Provide team leadership in module development and coordinate a development team.
• Make key decisions, set goals and metrics for team success.
• Innovate to address complex problems and drive IP generation for new technologies.
• Coordinate cross-functional activities for rapid project progress and support technology transfer to high-volume manufacturing.
• Communicate key information and drive decisions through presentations and group discussions.
• Continuously develop technical and management skills through on-the-job training.

Skills

Data analysis

Problem solving

Process integration

Team leadership

Communication

Statistical analysis

Education

PhD in Electrical Engineering

Master’s in Electrical Engineering

Bachelor’s in related field

Tools

Python

SolidWorks

Tableau

Power BI

Job description

As aMember of Technical Staff inNAND Module Process IntegrationTeamthe Singapore R&D department at MicronSemiconductor Operation Pte Ltd,you will be responsible for designing, developing, integrating, and implementing innovative and effective process solutions to improve next-generation 3D NAND Product Yield and Quality with competitive cost and performance within the required timeline.

Your responsibilities will include, but are not limited to, the following:

• Module Ownership: Lead one or more process modules related to the development and operation of a 3D NAND semiconductor integrated circuit.
• Specification definition: Define structural specifications and process requirements for assigned modules.
• Strategic Direction: Set a clear direction and vision for the module and have a well-defined continual improvement plan.
• Proactive Issue Resolution: Be proactive inidentifyingpotentialstructure, electrical and reliability issues and addressing them early with process control. Solve problems with a model-based approach.
• Performance Optimization: Focus on structural development, electrical performance, parametric verification, and process control and manufacturability assessment and optimization.
• Material Innovation: Analyze materials physically, electrically, etc. and work with process groups,etcto select new material for development. Drive material changes from research into production.
• Design Experiments: Design and implement device and process experiments to perform process development and process integration. Extract, analyze,reportand draw logical conclusions on experiments and clarify the statistical significance of the data.
• Team Leadership: Provide team leadership in module developmentwithassembling and coordinating a development team including process engineers, etc.
• Decision-Making & Goal Setting: Make key decisions for the team, as well as provide clear direction,goalsand metrics for success of the team.
• Innovation & IP Generation: Innovate to address complex problems through both design and process. And consider new options for improving and developingnew technologiesor devices. Patent disclosures are expected on a regular basis.
• Multi-functional Coordination: Coordinate activities such as reticletape outs, flow/traveler changes, lot management, etc. across multi-functional teams to enable a project toproceedin a rapid and low error manner.
• Technology Transfer: Support the transfer ofnew technologyfrom R&D to high volume manufacturing.
• Communication & Influence: Communicate key information and projects via presentations and group discussion and drive decisions.
• Continuous Development: Continually grow technical and management skills and pursue continued education via on-job training and trainingclass.
• Integrates Artificial Intelligence (AI)-assisted tools and insights into daily work to improve efficiency, quality, or effectiveness, exercising sound judgment and complying with organizational standards and legal requirements.

Successful candidates for this position will have:

Must have:

• Passionate about semiconductor technology and innovation.
• Adept at data analysis, problem-solving, and process integration optimization.
• Excellent communication skills and capacity to collaborate within multi-functional teams.

Requirements:

Education:

• PhD≥8yrs, or Master’s ≥11yrs, or Bachelor’s ≥13yrsinElectrical Engineering, Microelectronics, Materials Science, Chemical Engineering, Physics, or related field with semiconductor industry experience
• Proficiencyin scripting/programming/engineering/business intelligence/Analytics software, such as Python, SolidWorks, Tableau, Power BI, etc. is desirable.
• Ability to develop astrongcomprehensiveend-to-end understandingofparticular PImodules on new NAND technologies and related structural & electrical fail mechanisms.
• In-depth knowledge and direct experience with non-volatile memories (NAND) along with good understanding of the NAND process flow, the interaction of process & device, common yield & reliability issues are desirable.
• Experience in R&D and technology transfer within Semiconductor industry
• Committed to quality, collaboration, and continuous improvement.
• Ability to be self-motivated, and self-governing with proven track record to work in a demanding & dynamic environment.