DESENVOLVEDOR PACKAGING FOTONICO PL

Hwit; Campinas; Presencial; BRL 80 000 - 100 000; Tempo integral

Resumo da oferta

HwIT in Campinas, Brazil, is looking for a Packaging & Product Development Engineer to support hardware lifecycle for photonic modules. The role involves development and validation of processes related to optoelectronic packaging.

The ideal candidate has a Bachelor’s Degree in relevant fields and 2-5 years of experience in the industry. Proficiency in 3D CAD software and thermal simulation tools are essential for this role.

Qualificações

• Minimum of 2–5 years of solid experience in microelectronic or optoelectronic packaging processes.
• Knowledge of structural adhesives, precision soldering, and interconnect metallurgy.
• Experience in optomechanical design and electronic hardware packaging.

Responsabilidades

• Develop 3D CAD models for optoelectronic packaging.
• Conduct Finite Element Analysis (FEA) for thermal and mechanical simulations.
• Validate designs against empirical data from testing.

Conhecimentos

Optomechanical design

Mechanical engineering

3D CAD software

Thermal simulation

Material qualification

Formação académica

Bachelor's Degree in Materials Engineering, Mechanical Engineering, Electronics, or related fields

Ferramentas

SolidWorks

ANSYS

Descrição da oferta de emprego

JOB MISSION

HwIT is seeking a Packaging & Product Development Engineer focused on optical commutations products. You will be a key technical contributor supporting the hardware lifecycle of our photonic modules — from assisting in mechanical/thermal simulations and 3D CAD design to the execution, validation, and optimization of cleanroom packaging processes.

Your main focus will be a hands‑on environment bridging R&D design with manufacturing reality: supporting multiphysics simulations, detailing micro‑assemblies, executing DOEs (Design of Experiments) for method validation, and technically investigating root causes to ensure structural integrity and maximize yield in global scale production.

SCOPE & RESPONSIBILITIES

1. Product Development and Validation

• Mechanical & Optomechanical Design for Packaging: Develop 3D CAD models and detailed 2D manufacturing drawings for high‑precision optoelectronic packages, test fixtures, and structural assemblies, applying GD&T standards.
• Multiphysics & Thermal Simulation: Conduct Finite Element Analysis (FEA) and Computational Fluid Dynamics (CFD) to simulate thermal dissipation, mechanical stress, and structural integrity of photonic modules.
• Prototyping & Design Validation: Support the rapid prototyping phase and work closely with the Reliability testing team to validate simulation models against empirical data from testing (e.g., Telcordia GR‑468, MIL‑STD).

2. Process Development and Validation

• Critical Parameter Optimization: Assist in defining and optimizing critical process parameters such as die attach (e.g., conductive epoxies, eutectic soldering), wire bonding, and optical alignment.
• Encapsulation Techniques: Develop hermetic and semi‑hermetic encapsulation techniques for photonic modules.
• Material Qualification: Validate new materials, adhesives, and sealing processes according to high‑reliability standards.

3. Yield Optimization and Troubleshooting

• Root Cause Investigation: Run investigative activities in cleanroom processes to detect the root cause of issues affecting the yield and assembly times of photonic components.
• Design of Experiments (DOE): Run DOEs to characterize processes, define critical variables, and find the best assembly recipes.
• SPC Alignment: Validate and approve operational methods and process parameters consistent with the Statistical Process Control (SPC) required by Product Engineering.

4. NPI Integration and Manufacturability

• Design for Manufacturing (DFM): Execute DFM and development activities in packaging components under senior guidance, promoting technical alignment between suppliers and developers, and evaluating the technical feasibility of new components.
• Team Training: Documentation and training the operational team in the meticulous execution of complex encapsulation recipes and methodologies;
• Process Transference: Collaborate side‑by‑side with Product Engineers and Senior Packaging Engineers to validate assemblies and transfer packaging assembly processes to high‑volume manufacturing sites.

CANDIDATE PROFILE

Education & Background

Essential:

• Bachelor's Degree in Materials Engineering, Mechanical Engineering, Electronics, Physics, or related fields.
• Minimum of 2–5 years of solid experience in microelectronic or optoelectronic packaging processes.
• Knowledge of structural adhesives, precision soldering, and interconnect metallurgy.
• Familiarity with failure analysis methodologies (SEM, EDS, X‑Ray, Cross‑section).
• Experience in optomechanical design, precision mechanics, or electronic hardware packaging.
• Proficiency in 3D CAD software (e.g., SolidWorks, Creo, Inventor) and understanding of GD&T.
• Track record participating in thermal and structural simulations using tools like ANSYS, COMSOL, or SolidWorks Simulation.

Desirable:

• Experience with PICs (Photonic Integrated Circuits) and fiber-to-chip interfaces.
• Knowledge of reliability standards (MIL‑STD‑883, Telcordia GR‑468, or NASA EEE‑INST‑002).
• Experience with continuous improvement tools (Six Sigma, Lean Manufacturing).
• Knowledge of automation programming in Python, C#, or LabVIEW.
• Experience designing complex hermetic packages (e.g., Butterfly, TO‑can) and managing micro‑assembly tolerances.
• Background in designing customized mechanical fixtures for High‑Temperature Operating Life (HTOL) and environmental testing.

Languages

• Portuguese: Native;
• English: Mandatory — Advanced/Fluent (B2/C1 level) for day‑to‑day communication with international partners.
• Spanish: Desirable.