Investigating chemical etch uniformity in 3D structures

Imec India Private Limited; Vlaams-Brabant; Sur place; EUR 25 000 - 35 000; Plein temps

Résumé du poste

A leading semiconductor research institute in Belgium is seeking a research intern to investigate surface chemistry and etching kinetics of semiconductor materials. The role involves characterizing material properties, developing measurement techniques, and analyzing etch uniformity in advanced semiconductor structures. Candidates should possess a Master's degree in relevant fields and strong analytical skills. This position presents an opportunity for self-supporting students to contribute to cutting-edge technology.

Qualifications

• Solid background in (physical) chemistry, physics, or material science.
• Strong problem-solving, writing, and oral communication skills.

Responsabilités

• Investigate differences in material properties between blanket and patterned surfaces.
• Establish techniques to measure etch uniformity in 3D structures.
• Assess the uniformity of wet etching processes in 3D structures.

Connaissances

Problem-solving skills

Writing skills

Oral communication skills

Formation

Master of Science

Master of Engineering Science

Master of Engineering Technology

Outils

SEM

TEM

ATR-FTIR

Ellipsometry

Scatterometry

AFM

TOF-SIMS

Description du poste

The surface chemistry characterization and etching kinetics of semiconductor materials like Si, SiGe, and dielectrics such as SiO2 and Si3N4 are crucial for advancing semiconductor technology. Although these materials form the foundation of modern electronic devices, there remains a significant gap when it comes to understanding the intrinsic differences in their surface properties and etching behavior, particularly on patterned and high aspect ratio (HAR) structures. HAR structures, increasingly used in advanced semiconductor devices, pose unique challenges in terms of etch uniformity, selectivity and characterization techniques. This study aims to address these gaps by combining state-of-the-art test vehicles with advanced metrology techniques.

Objectives

1. Characterize Material Properties: Investigate the differences in material properties between blanket and real patterned surfaces.
2. Develop Characterization Techniques: Establish and refine techniques to measure and analyze etch uniformity in 3D structures.
3. Analyze Etch Uniformity: Assess the uniformity of wet etching processes in 3D structures.

Methodology

1. Sample Preparation and Etching: Prepare samples and chemistry solutions for beaker tests.
2. Characterization Techniques: Utilize advanced characterization techniques such as SEM, TEM, ATR-FTIR, ellipsometry, scatterometry, AFM, TOF-SIMS.
3. Data Analysis: Compare the etch uniformity across different samples and identify key factors influencing non-uniformity.

The successful candidate should have a solid background in (physical) chemistry, physics or material science, with strong problem-solving skills and good writing and oral communication skills.

Type of work: literature 10 %, 50% experiments and 40 % analysis and modeling.

Type of Project: Combination of internship and thesis; Thesis; Internship

Master's degree: Master of Science; Master of Engineering Science; Master of Engineering Technology

Master program: Chemistry/Chemical Engineering; Materials Engineering; Nanoscience & Nanotechnology; Physics

Supervisor: Stefan De Gendt (Chemistry, Nano)

For more information or application, please contact the supervising scientist XiuMei Xu.

Only for self-supporting students.