Package Platform Data & Dashboard Intern

Infineon; Western Australia; Presencial; AUD 18.000 - 32.000; Tempo integral

Resumo da vaga

Infineon is offering an internship role within the Package Concept development team. You will generate a database and develop a dashboard comparing New Package Requirements (NPI) with Qualified/Productive Package/Product references, using data from the IFX database.

Mentored by a designated supervisor, you will gain exposure to semiconductor packaging concepts and data analytics. The role emphasizes data management, strategic simplification of complex datasets, and collaboration with technical

Qualificações

• Pursuing a career in Engineering with focus on Electronics, Materials, Chemical or Data Analytics.
• Basic understanding of semiconductor Process, Material and Technology.
• Experience or exposure to AI, digitalisation and programming concepts.
• Self-motivated, well-organised and able to work independently.

Responsabilidades

• Understand Key Package Requirements for New Product Introduction (NPI) including Technology, BoM, Design Features, Assembly Site, Electrical specs and Cost.
• Enable fast strategic thinking by simplifying large data sets according to Package requirements.
• Collect, clean and organise data from the IFX Database.
• Generate a customizable database based on predefined package requirements (Technology, BoM, Design Features, Assembly Site, Electrical, Cost).
• Create a dashboard comparing NPI Requirements vs. Qualified Product by attributes.

Conhecimentos

Semiconductor knowledge

AI exposure

Digitalisation

Programming languages

Formação

Engineering student (electronics, materials, chemical, or data analytics)

Descrição da vaga

Infineon is offering an internship role within the Package Concept development team. You will generate a database and develop a dashboard comparing New Package Requirements (NPI) with Qualified/Productive Package/Product references, using data from the IFX database.

Mentored by a designated supervisor, you will gain exposure to semiconductor packaging concepts and data analytics. The role emphasizes data management, strategic simplification of complex datasets, and collaboration with technical