Packaging Design & Data Analytics Intern

Infineon; Western Australia; Presencial; AUD 40.000 - 60.000; Tempo integral

Benefícios oferecidos por esta vaga

Infineon internship program

Resumo da vaga

Infineon Technologies Australia invites an undergraduate/graduate student to join a global team focused on package design and selection. The role involves analysing and digitising the package assembly database, spearheading a platform for optimal package selection for customer design acceptance, and building an application for package information and analysis.

The internship emphasizes Advanced Packaging concepts, end-to-end product exposure, and collaboration within a global team, with hands-on

Qualificações

• Bachelor's/Master's pursuing engineering studies
• Semiconductor fundamentals
• Analytical capability with large datasets
• Digitalisation or programming exposure (preferred)
• Initiative and adaptability
• Self-management and organization
• Preferred intake: Jan 27 – May/June 27

Responsabilidades

• Understand package criteria (electrical, structural, quality) for automotive applications
• Conduct in-depth data analysis of datasets to inform package concepts
• Collect, clean and organize data from multiple sources for analysis
• Develop a dashboard for package selection
• Build a handphone app for package information retrieval

Descrição da vaga

Infineon Technologies Australia invites an undergraduate/graduate student to join a global team focused on package design and selection. The role involves analysing and digitising the package assembly database, spearheading a platform for optimal package selection for customer design acceptance, and building an application for package information and analysis.

The internship emphasizes Advanced Packaging concepts, end-to-end product exposure, and collaboration within a global team, with hands-on