Staff / Senior Staff Engineer Package Technology Development

Infineon; Western Australia; On-site; AUD 210,000 - 270,000; Full time

Job summary

Infineon seeks a Staff / Senior Staff Engineer in Package Technology Development to shape future packaging platforms in our R&D team. You will lead outsourced qualification efforts and drive process optimization at subcontractors, defining package concepts and ensuring robust assembly and test readiness across OSAT partners.

The role requires a strong background in module assembly, WLP, eWLB, and SiP, with 10+ years in package development and at least 3 years in project management support.

Qualifications

• Master or Bachelor degree in Engineering disciplines.
• Minimum 10 years’ working experience of package development in new product introduction or process.
• At least 3 years in supporting project management.
• Experience in Module assembly, Wafer level package (WLP), bumping, eWLB and System in Package (SiP) is a key advantage.
• Good knowledge of processes and material in laminates and leadframe packages and interaction with design teams.

Responsibilities

• Responsible for outsourced package platform qualification and process optimization at subcons.
• Responsible for package definition tasks in OSAT segment.
• Integration of unit processes till process freeze for assembly and test at subcons.
• Apply and verify design rules based on baseline documents and equipment capability.
• Define process and select BOM to meet MSL and reliability requirements.
• Enable new package platforms and derivatives at OSAT; support development.
• Driver or co-driver for platform-related Task Force activities and technical problem solving.

Skills

Leadership experience

Analytical skills

Communication skills

Team collaboration

Problem solving

Decision making

Prioritization

Cross-cultural collaboration

Project management exposure

Knowledge transfer

Education

Master or Bachelor degree in Engineering

Job description

#WeAreIn for jobs that impact everyone's life. What if your ideas could change the way the world connects, powers up, or thinks? As a Staff / Senior Staff Engineer Package Technology Development in our Research & Development team, you'll have the opportunity to merge creativity with your technical expertise by shaping the future of technology, driving groundbreaking projects, and bringing new ideas to life. Are you in?

Your Role

Key responsibilities in your new role

• Responsible for outsourced package platform qualification (lead and follower products) and process optimization at subcons to meet the time-to-market, product quality level, process capability and assembly yield target.
• Responsible for package definition tasks in OSAT segment in defining project complexity definition with Delta assessment list, project category assessment and Perform project risk assessment with mitigation actions.
• Responsible for integration of unit processes till process freeze for assembly and test at subcons which entails creating assembly specification, marking instruction and packing specification for upload into Database.
• Apply and verify design rules based on established baseline documents as well as specific equipment and process capability of specific assembly sites. This includes OSATs technical capability assessment support role.
• Define process and select Bill of Material as needed to meet MSL, reliability level, and other specific package requirements for development and pre-development.
• Responsible for enabling of new package platform and derivatives packages, and support of technology and package development at OSAT. This includes new subcon enabling support role.
• As a driver or co-driver for platform related Task force activities and has ability to drive for technical problem solving.

Your Profile

Qualifications and skills to help you succeed

• Master or Bachelor degree in Engineering disciplines.
• Minimum 10 years’ working experience of package development in new product introduction or process (pre-assembly, assembly and test) and 3 years in supporting project management.
• Experience in Module assembly, Wafer level package (WLP), bumping, eWLB and System in Package (SiP) will be a key advantage.
• Good knowledge of processes and material in both laminates and leadframe packages and interaction to the different functions (laminate/ leadframe design, design rules, process)
• Good understanding of quality requirements / release criteria (e.g. JEDEC/AEC grade) that fits and matches product/package design and BOM sets selection.
• Strong analytical skills, ability to deal with conflict. Live up to high quality standards. Good quality mind-set and excellent problem solving.
• Demonstrates active knowledge transfer and best practice sharing across organizational boundaries, be ambitious and ability to make timely decisions.
• Highly motivated with the ability to prioritize, perform under pressure and get team members and stakeholders involved and to motivate them.
• Ability to collaborate and work as a team with various stakeholders and partners in multi-site/multi-cultural teams.
• Strong in communication and people interpersonal skills across all levels.
• Experience in Subcon management.

Contact: Carol Lee #WeAreIn for driving decarbonization and digitalization. As a global leader in semiconductor solutions in power systems and IoT, Infineon enables game-changing solutions for green and efficient energy, clean and safe mobility, as well as smart and secure IoT. Together, we drive innovation and customer success, while caring for our people and empowering them to reach ambitious goals. Be a part of making life easier, safer and greener. Are you in? We are on a journey to create the best Infineon for everyone. This means we embrace diversity and inclusion and welcome everyone for who they are. At Infineon, we offer a working environment characterized by trust, openness, respect and tolerance and are committed to give all applicants and employees equal opportunities. We base our recruiting decisions on the applicant's experience and skills. Learn more about our various contact channels.