Staff Engineer: 3D/TSV Process & Tech Lead

ams OSRAM; Premstätten; Vor Ort; EUR 90.000 - 130.000; Vollzeit

Benefits dieser Stelle

Competitive salary

Zusammenfassung

ams OSRAM is seeking a highly skilled engineer to develop manufacturing process modules and lead teams in the area of advanced 3D integration. The role requires ownership of projects from concept through implementation, with a strong emphasis on documentation, quality, and timely execution.

Candidates should hold a Master’s or PhD in Physics, Chemistry, or a related discipline, have deep TSV experience, and be proficient in English.

Qualifikationen

• Advanced university degree in Physics, Chemistry, or related field.
• Strong understanding of TSVs with focus on development and industrialization of process modules.
• Experience with Wafer-to-Wafer bonding and Die-to-Wafer stacking for 3D/heterogeneous integration concepts.

Aufgaben

• Develop manufacturing process modules from concept to implementation.
• Lead sub-teams within larger projects and own work packages.
• Define, implement, analyze and document experiments.
• Apply risk assessment techniques (e.g., FMEA) and mitigate risks during development.

Kenntnisse

TSV knowledge

3D integration

Wafer-to-Wafer bonding

Die-to-Wafer stacking

Project leadership

English proficiency

Data-driven reporting

Ausbildung

Master’s or PhD in Physics, Chemistry, or related

Jobbeschreibung

ams OSRAM is seeking a highly skilled engineer to develop manufacturing process modules and lead teams in the area of advanced 3D integration. The role requires ownership of projects from concept through implementation, with a strong emphasis on documentation, quality, and timely execution.

Candidates should hold a Master’s or PhD in Physics, Chemistry, or a related discipline, have deep TSV experience, and be proficient in English.