WPM C4 Quality and Reliability Engineer

Intel Corporation; Hillsboro (OR); On-site; USD 89,000 - 126,000; Full time

Benefits offered by this job

Stock bonuses

Health benefits

Vacation

Job summary

Intel Corporation in Hillsboro, Oregon, is seeking a Quality and Reliability Engineer (QRE) to join the Foundry Quality, Reliability, and Labs (FQRL) organization. This on-site role requires evening meetings and active collaboration with fab module engineers, process integration teams, and global colleagues.

The role focuses on managing quality, performing data-based risk assessments, supporting excursions, and driving continuous improvements to material reliability and process quality across

Qualifications

• Master’s degree in Engineering, Science, or related discipline.
• At least 6 months experience in manufacturing processes, quality assessment, or reliability concepts.
• Proficiency in JMP or Minitab for statistical analysis.

Responsibilities

• Manage customer quality issues on products (internal and external).
• Extract and analyze data to support risk assessment of suspect/non-conforming material.
• Support excursions investigations and respond to issues with downstream partners.
• Collaborate with other organizations to drive improvements in quality and reliability.

Skills

Statistical analysis

Problem-solving

Communication

Education

Master’s degree in Engineering/Science/related field

Tools

JMP

Minitab

Job description

Job Details:

Job Description:

As a world’s leading chip manufacturer, Intel strives to make every facet of semiconductor manufacturing state-of-the-art. From semiconductor process development and manufacturing, through yield improvement to final test and optimization, and lastly advanced die prep and packaging. Employees in Intel Foundry are part of a worldwide network of manufacturing, advanced packaging, and assembly/test facilities.

As a Quality and Reliability Engineer (QRE), you will be part of FQRL (Foundry Quality, Reliability, and Labs), Intel’s Quality and Reliability organization. We are strong believers in partnership, collaboration and teamwork. You will routinely work with the fab module engineers, process integration[RB1.1] and worldwide employees both internal and external to Intel. This is an on-site role that requires living in Oregon. This role requires evening meetings most work days.

The Wafer Packaging Manufacturing (WPM) organization owns a crucial part of semiconductor wafer processing, testing, and die-to-wafer assembly. In addition to traditional product types, we drive Intel’s advanced packaging strategy - bringing compelling capabilities to market and enabling large-scale AI computing. C4 (bumping) QREs cover several critical process segments[RB2.1] such as interposer, micro‑logical, and package side bumping in the WPM organization.

Your key deliverables will include:

• Manage customer quality (both internal and external) issues on products.
• Extract and Analyze data to support risk assessment of suspect/non-conforming material.
• Support and engage with down-stream partners to manage excursions, down-stream investigations, and respond to issues.
• Partnering with other organizations to proactively drive improvements in quality and reliability performance.
• Ensure that the metrics and goals for the end-of-line-hold operations are met, as well as MRB (Material Review Board) [RB3.1]inventory.
• Identify and drive activities and projects to improve detection and containment of potentially discrepant or unreliable material.
• Support Certification and Ramp of new technologies from on‑site and off‑site development teams.
• 24x7 on-call response (as part of an engineering rotation) to respond to urgent line issues, excursions, or to support task force-level projects.

The ideal candidate should exhibit the following behavioral traits:

• Strong communication and collaboration skills with the ability to work effectively across cross‑functional teams.
• Experience in manufacturing environments or familiarity with high-volume production processes.
• A growth mindset and active interest in continuous learning and development.
• Make technical decisions and provide technical direction.
• Evidence of organizational and planning skills for engineering projects.
• Demonstrate effective communication up and down the organization, including skills to communicate technical issues and status to factory and program leadership.
• Effectively work in a highly networked, cross organization role.
• Exhibit strong team building and influencing skills.
• Work under pressure, and in an ever‑changing and dynamic environment

Qualifications:

You must possess the below minimum qualifications to be initially considered for this position. Preferred qualifications are in addition to the minimum requirements and are considered a plus factor in identifying top candidates. Requirements listed would be obtained through a combination of industry relevant job experience, internship experiences and or schoolwork/classes/research.

Minimum Qualifications:

• Master’s degree in a specialized field such as Engineering, Science, or a related discipline

At least 6 months of experience in the following:

• Knowledge of manufacturing processes, semiconductor fabrication, and quality assessment methodologies.
• Familiar with excursion management, reliability fundamentals, or problem‑solving techniques.
• Proficiency in statistical analysis techniques and tools, such as JMP or Minitab.

Preferred Qualifications:

• Master’s degree in Engineering or Science, with semiconductor foundry experience.
  -Ability to write automation scripts to improve efficiency of data extraction and analysis.

• Proven ability to collaborate across cross‑functional teams and represent quality functions in engineering forums.

• Strong communication and leadership skills, with a proactive approach to driving process optimization.

• Demonstrated ability to manage change control processes and drive continuous improvement programs

• Familiarity with product and process reliability principles and methods.

• Knowledge of quality control systems and methodologies.

Job Type:

College Grad

Shift:

Shift 1 (United States of America)

Primary Location:

US, Oregon, Hillsboro

Posting Statement:

All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance.

Position of Trust

N/A

Benefits

We offer a total compensation package that ranks among the best in the industry. It consists of competitive pay, stock bonuses, and benefit programs which include health, retirement, and vacation. Find out more about the benefits of working at Intel.

Annual Salary Range for jobs which could be performed in the US: $89,010.00-125,660.00 USD

The range displayed on this job posting reflects the minimum and maximum target compensation for the position across all US locations. Within the range, individual pay is determined by work location and additional factors, including job‑related skills, experience, and relevant education or training. Your recruiter can share more about the specific compensation range for your preferred location during the hiring process.

Work Model for this Role

This role will require an on-site presence. * Job posting details (such as work model, location or time type) are subject to change.

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ADDITIONAL INFORMATION: Intel is committed to Responsible Business Alliance (RBA) compliance and ethical hiring practices. We do not charge any fees during our hiring process. Candidates should never be required to pay recruitment fees, medical examination fees, or any other charges as a condition of employment. If you are asked to pay any fees during our hiring process, please report this immediately to your recruiter.