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TTM Technologies, Inc. is seeking a Via Fill Operator for the San Jose, CA facility. You will operate via fill and planarization equipment to improve copper bonding and surface functionality, while performing quality checks and daily housekeeping.
The role requires reading prints or drawings, standing for long periods, and lifting up to 30 lbs. High school diploma or equivalent is preferred and prior manufacturing experience is a plus.
TTM Technologies, Inc. is seeking a Via Fill Operator for the San Jose, CA facility. You will operate via fill and planarization equipment to improve copper bonding and surface functionality, while performing quality checks and daily housekeeping.
The role requires reading prints or drawings, standing for long periods, and lifting up to 30 lbs. High school diploma or equivalent is preferred and prior manufacturing experience is a plus.