Thin Films Equipment Engineering Intern (Data & AI)

Micron Technology, Inc; Boise (ID); Hybrid; USD 28,000 - 36,000; Part time

Job summary

Micron Technology, Inc. in Boise, Idaho, invites you to join the Thin Films Equipment Engineering internship to gain hands-on experience with semiconductor equipment and processes. You will support equipment optimization, data analysis, and technology development while collaborating with cross-functional teams.

You will apply AI and analytics to improve engineering workflows. Candidates are pursuing a Bachelor’s or Master’s degree in engineering, with strong analytical, data collection and

Qualifications

• Pursuing a Bachelor's or Master's degree in Electrical Engineering, Mechanical Engineering, Chemical Engineering, Materials Science, Physics, or a related field.
• Demonstrated analytical and problem-solving skills through coursework, projects, internships, or research experience.
• Ability to collect, organize, and analyze technical data using engineering or statistical methods.
• Effective verbal and written communication skills with the ability to present technical information clearly.
• Availability to complete an internship aligned with academic program requirements.

Responsibilities

• Collect, analyze, and interpret equipment and process data to find opportunities for performance optimization and continuous improvement.
• Support structured engineering experiments, document findings, and communicate results through technical reports and presentations.
• Collaborate with Equipment Engineering, Process Engineering, Facilities Engineering, and equipment suppliers to address technology-development challenges and improve equipment performance.
• Develop an understanding of equipment hardware, process interactions, and operating conditions to fix and solve engineering issues.
• Leverage Artificial Intelligence and data analytics tools to enhance data-driven decision-making, identify trends, and improve engineering workflows.

Skills

Analytical skills

Data analysis

Communication skills

Education

Bachelor’s or Master’s degree in Electrical Engineering, Mechanical Engineering, Chemical Engineering, Materials Science, Physics

Tools

Python

SQL

JMP

Job description

Micron Technology, Inc. in Boise, Idaho, invites you to join the Thin Films Equipment Engineering internship to gain hands-on experience with semiconductor equipment and processes. You will support equipment optimization, data analysis, and technology development while collaborating with cross-functional teams.

You will apply AI and analytics to improve engineering workflows. Candidates are pursuing a Bachelor’s or Master’s degree in engineering, with strong analytical, data collection and