Thermal Engineer: Electronic Cooling for High-Density Systems

Amphenol Corporation

Yocumtown (PA)

On-site

USD 85,000 - 125,000

Full time

9 days ago

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Job summary

Amphenol Corporation's Amphenol Communications Solutions is seeking a Thermal Engineer to advance active thermal management for high-speed interconnects at our Etters, PA site. You will design, simulate, and validate cooling solutions that meet performance, reliability, and manufacturability goals.

The ideal candidate has 3+ years in thermal design, strong CFD skills (Icepak, FloTHERM), instrumentation, and CAD fluency.

Qualifications

Bachelor’s or Master’s degree in Mechanical Engineering, Thermal Engineering, or a related field.
3+ years of industry experience in thermal design or analysis for cooling electronic systems or interconnect hardware preferred.

Responsibilities

Engage directly with customers to gather thermal boundary conditions, system-level constraints, and performance requirements.
Develop and execute thermal models using CFD tools (e.g., ANSYS Icepak, FloTHERM, or equivalent).
Analyze airflow, temperature distribution, and heat dissipation for active thermal solutions in high-density electronic cooling environments.
Work with lab teams to plan and conduct thermal testing and validation.
Correlate experimental data with simulation results to refine and validate models.
Identify and troubleshoot thermal design issues through root-cause analysis and iterative testing.
Prepare detailed technical reports summarizing analysis, findings, and recommendations.
Present results and optimized solutions to customers and cross-functional teams.