Thermal Engineer

Arieca; Pittsburgh (Allegheny County); On-site; USD 90,000 - 130,000; Full time

Benefits offered by this job

Healthcare

Flexible PTO

Stock options

401(k) matching

Job summary

Arieca is seeking a Thermal Engineer to join our Hardware R&D team in Pittsburgh, focusing on liquid cooling solutions for TIM test vehicles and semiconductor interfaces. The role combines hands-on design, experiments, data collection, and customer-facing documentation, with opportunities to engage customers and external partners in a startup environment.

You will work with a diverse team of scientists and engineers, contributing to products from lab to market with exposure to customers and

Qualifications

• Hands-on experience with single-phase liquid cooling systems.
• Experience with microcontrollers for data collection and system management.

Responsibilities

• Design and implement liquid cooling test vehicles and hardware.
• Conduct experiments to test thermo-mechanical properties of interfaces.
• Create professional customer-facing documentation and reports.

Skills

Liquid cooling

Thermal testing

Arduino / Raspberry Pi

Python / Matlab / C++

LabVIEW GUI

Data collection / analysis

Customer communication

Hands-on experimentation

Education

Bachelor of Science in Mechanical/Electrical/Mechatronics

Tools

Ansys

Autodesk Fusion 360

Job description

Thermal Engineer – Full Time Job Opportunity

Who We Are:

Arieca is leading the commercialization of easy to deploy liquid metal embedded elastomer (LMEE) technologies, which enable unprecedented performance in applications across semiconductor, electronics, automotive, and healthcare industries. Our TIMbber TM product line targets leading semiconductor thermal interface material (TIM) challenges. As a CMU spin-out, venture-backed company, we are expanding our team to bring our lab innovations to market.

What We Need:

Arieca is looking for a Thermal Engineer who will join our Hardware R&D team to assist the successful market introduction of our thermal interface materials (TIM). Responsibilities include design and implementation of liquid cooling solutions for thermal test vehicles, in addition to designing and implementing experiments to test hypotheses on understanding the thermo-mechanical properties of semiconductor interfaces in packaged electronics (smartphones, laptops, GPUs). Strong organizational, analytical and communication skills are required, as we need to collect data efficiently and create professional customer facing documentation, while developing processes and systems that work well within the constraints of a startup. Engagement with customers, external vendors and ecosystem partners is possible.

You will be working with a team of highly motivated and ambitious individuals with a diverse background of exceptional scientific, entrepreneurial, and industrial experiences. This position offers competitive salary and benefits including healthcare, flexible PTO, stock options, and 401(k) matching.

Key Requirements:

• Minimum of 1-3 years of experience working in industry or an academic research laboratory, withs significant hands-on work on single phase liquid cooling solutions (implementation of cold plates, heaters, thermocouples, pumps, chillers, etc.)
• Experience with microcontrollers like Arduino and Raspberry Pi for real time physical control and data collection/processing and system management
• Solid foundation in thermal science, including material characterization (e.g. ASTM D5470, thermal test vehicles)
• Familiar with at least one thermomechanical simulation tool (Ansys, Autodesk Fusion, etc.).
• Experience with scientific programming in Python, Matlab, or C++. On the job, we will develop GUIs for DAQ systems, so expertise here is a bonus. Significant skills designing GUIs in LabView can substitute here.
• Bachelor of Science or higher in Mechanical Engineering, Electrical Engineering, Mechatronics, or equivalent degrees.
• Meticulous organizational skills, attention to detail, and pride in producing high-quality work

Nice to have:

• Experience designing analog electrical circuits, semiconductor packages or substrates (flip-chip, BGA, LGA, etc.), or data acquisition systems
• Rapid prototyping and machine shop experience.
• Experience in semiconductor industry, nondestructive testing or reliability engineering.

Arieca is committed to principles of diversity and inclusion, and encourages candidates to apply even if they do not exhibit all of the above-mentioned characteristics.