Thermal Design Lead for High-Power SoCs

Apple; United States; On-site; USD 130,000 - 200,000; Full time

Job summary

Apple is seeking a Thermal Engineer to design and validate cooling solutions for high‑performance computing systems. You will perform simulations and testing, and collaborate across teams to ensure robust thermal performance across product lines.

The role requires a Bachelor's degree and deep expertise in thermal design for silicon devices, packaging solutions, and advanced testing of thermal data. Strong leadership and experience with IC design parameters are highly valued.

Qualifications

• Bachelor's degree required.
• Strong leadership capabilities and senior engineer-level experience.
• Deep expertise in thermal design for silicon devices and packaging solutions.
• Proven experience with IC physical design parameters and their impact on electrical and thermal performance.
• Understanding of SoC design methodologies, low-power design techniques, and thermal analysis approaches.
• Knowledge of advanced packaging assembly processes including electrical and thermal characteristics.
• Hands-on experience in thermal design, analysis, and validation of cooling solutions for high-power SoCs.

Responsibilities

• Design and validate cooling solutions for high-performance computing systems.
• Perform simulation and testing to ensure thermal performance and reliability across product lines.
• Collaborate with cross-functional teams to optimize products’ thermal management.

Skills

Leadership

Thermal design

IC design parameters

SoC design

Low-power design

Thermal analysis

Packaging knowledge

Thermal testing

Education

Bachelor's degree

Tools

Ansys IcePak

Sentinel-TI

Fluent

Cadence Allegro

RedHawk

Job description

Apple is seeking a Thermal Engineer to design and validate cooling solutions for high‑performance computing systems. You will perform simulations and testing, and collaborate across teams to ensure robust thermal performance across product lines.

The role requires a Bachelor's degree and deep expertise in thermal design for silicon devices, packaging solutions, and advanced testing of thermal data. Strong leadership and experience with IC design parameters are highly valued.