Test Engineer

GP Tech Group; Lake Forest (IL); On-site; USD 90,000 - 125,000; Full time

Job summary

GP Tech Group in Lake Forest, CA seeks a Test Engineer with a Bachelor of Science in engineering or related field to plan, conduct, and optimize wafer-level and packaged device testing. You will work with wafer Fab and assembly suppliers, preparing test plans and analyzing data to drive reliable device performance.

Strong knowledge of electrical test methods, packaging, and ERP familiarity is required, along with excellent communication and proficiency in AutoCAD and statistical analysis

Qualifications

• Bachelor of Science degree in an engineering or related scientific discipline.
• Advanced knowledge in electrical engineering, semiconductor device test and packaging, ERP desirable.
• Equivalent combination of education, training and experience.
• Excellent communication and presentation skills (verbal and written).
• Experience with AutoCAD and MS Office; familiarity with statistical analysis software (e.g. MiniTab, JMP).

Responsibilities

• Prepare/modify electrical test equipment plans for wafer-level and packaged devices.
• Interface with wafer Fab and assembly suppliers to ensure timely material and product delivery.
• Plan, schedule, conduct, and coordinate engineering work and projects.
• Analyze reports, maps, drawings, tests and data to plan and design work.
• Work in an office or lab environment with possible travel to alternate sites.

Skills

Communication skills

Presentation skills

Electronics packaging knowledge

Electronic test equipment knowledge

Microsoft Office

Education

Bachelor of Science degree in engineering or related scientific discipline

Tools

AutoCAD

MiniTab

JMP

Job description

Job 128125 - Test Engineer
Lake Forest, CA

Position requires thorough knowledge of electrical design and engineering techniques, as well as CAD and graphics skills. Responsible to plan and conduct independent work requiring judgment in the evaluation, selection, application and adaptation of engineering techniques, procedures and criteria. Devise new approaches to problems, and prepare or modify drawings, specifications, calculations, charts and graphs, and monitor work for compliance to applicable codes, accepted engineering practices and Global Power Device Co. standards.

Typical duties will include but not be limited to the preparation and/or modification of the following:

Semiconductor wafer-level and packaged device electrical test equipment and test plans.

Microelectronic package related reliability test and measurement, including die shear, wire bond pull and environmental testing equipment and specifications.

Electrical drawings, specifications, calculations, charts and graphs.

Interface with wafer Fab and assembly suppliers to ensure timely material and product delivery.

Essential Functions:

Responsibilities will include but not be limited to the following:

Requires a solid knowledge of principles and practices of related technical areas.

Performs assignments independently with instruction as to the general results expected and with guidance from Department Manager and or engineering specialist on unusual or complex problems.

Plan, schedule, conduct, and coordinate program of assigned engineering work and projects.

Ensure proper interdisciplinary coordination and effective communication on projects.

Analyze reports, maps, drawings, tests, and other data to plan and design work.

Work Environmental & Physical Demands:

The characteristics described below are representative of those encountered while performing the essential functions of this position. Reasonable accommodations will be made to enable individuals with disabilities to perform the essential functions.

While performing duties of this job, would occasionally be required to stand, walk, sit, reach with hands and arms, climb or balance, stoop or kneel, talk and hear, and use fingers and hands to feel objects, tools or controls.

Must occasionally lift and/or move up to 25 pounds.

Specific vision abilities required include close vision, distance vision, depth perceptions, and the ability to adjust focus.

Job will generally be performed in an office or lab environment, and may require travel to visit alternate sites. Conditions will vary at each location, but the conditions listed above will generally apply.

Requirements

Education/Experience:

Bachelor of Science degree in an engineering or related scientific discipline. Advanced knowledge in electrical engineering, semiconductor device test and packaging, manufacturing engineering and enterprise resource planning (ERP) desired.

Equivalent combination of education, training and experience.

Skills and Special Requirements/Licensing:

Excellent communication and presentation skills (verbal and written).

A working knowledge of materials commonly used for advanced electronics packaging.

A working knowledge of electronic test equipment for semiconductor device and wafer parameter analysis.

Excellent computer skills in Microsoft Office, familiarity with AutoCAD and with statistical analysis software (e.g. MiniTab, JMP, etc.).