Technology Development Foundry Engineering - Senior Staff Engineer

Intel; Hillsboro (OR); On-site; USD 140,000 - 190,000; Full time

Job summary

Intel in Hillsboro, OR is seeking a Senior Staff Engineer in the Logic Technology Development group to lead customers through the full product development lifecycle, from design tape-out to production ramp. You will apply broad device engineering, process integration, and yield expertise to drive MPW/NPI programs, coordinate cross-functional teams, and ensure seamless transfer to high-volume manufacturing.

This role requires strong customer interaction, technical leadership, and the ability to

Responsibilities

• Drive end-to-end MPW and NPI execution across the full manufacturing flow, from front-end processing through far backend operations, ensuring quality and on-time delivery.
• Serve as the primary customer-facing interface for wafer status, silicon health, technical issues, process changes, and execution alignment.
• Own identification and resolution of customer-specific integration challenges.
• Drive enablement of customer-specific requirements through effective cross-functional coordination.

Job description

Job Details:

Job Description:

As the world's largest chip manufacturer and a global leader in innovation and advanced technology, Intel strives to make every aspect of semiconductor manufacturing state of the art, from process development and manufacturing to yield improvement, packaging, final test, optimization, and world-class supply chain and facilities support. Employees in the Technology Development and Manufacturing Group are part of a worldwide network of design, development, manufacturing, and assembly/test facilities focused on utilizing the power of Moore's Law to bring smart, connected devices to every person on Earth.We are constantly working to create a more connected and intelligent future, and we need your help. Change tomorrow. Start today.

What We Offer

We foster a collaborative, supportive, and exciting environment where some of the brightest minds in the world come together to achieve exceptional results. We provide opportunities to transform technology and create a better future by delivering products that impact the lives of people around the globe.

What We Do

Join the Logic Technology Development (LTD) organization, a powerhouse of process technology innovation driving Intel's IDM 2.0 strategy and enabling the success of our global foundry customers.We are seeking a versatile Senior Staff Engineer to be at the forefront of Intel's foundry transformation, serving as a pivotal technical partner who guides customers through the entire product development lifecycle. In this role, you will leverage multidisciplinary expertise spanning device engineering, product/process integration, and yield engineering to lead customers from design tape-out and pre-silicon evaluation through testing, validation, silicon qualification, and production ramp.You will also provide critical Far Back End (FBE) expertise in test, bump, and assembly while overseeing wafer manufacturing execution to ensure a seamless transition into High Volume Manufacturing (HVM). This is a unique opportunity to apply broad technical leadership, solve complex challenges, face customers, and actively shape the future of the semiconductor industry.

What You Will Do

We are seeking candidates with broad semiconductor expertise across foundry technology development. Depending on experience and business needs, responsibilities may include the following areas:

Product/process Integration

• Drive end-to-end Multi-Project Wafer (MPW) and New Product Introduction (NPI) execution across the full manufacturing flow, from front-end processing through far backend operations, ensuring quality and on-time delivery.
• Serve as the primary customer-facing interface for wafer status, silicon health, technical issues, process changes, and execution alignment.
• Own identification and resolution of customer-specific integration challenges.
• Drive enablement of customer-specific requirements through effective cross-functional coordination.

Device Engineering

• Serve as the primary customer interface for device performance, including manufacturing readiness reviews, performance roadmaps and projections, post-silicon characterization, model to hardware correlation, and resolution of customer-specific device issues.
• Track device performance targets and process control capability while assessing alignment between silicon results and PDK expectations.
• Drive device performance optimization through silicon learning, root-cause analysis, and cross-functional corrective actions to improve product readiness and close performance gaps.

Yield Engineering

• Serve as the primary yield point of contact throughout the product lifecycle, from design tape-out through High Volume Manufacturing (HVM).
• Develop predictive yield models to identify parametric and defect-related loss mechanisms and provide yield projections for test chips, shuttle vehicles, and production products.
• Lead deep-dive investigations into yield signals and nonconformances, partnering with Process Integration, Device Engineering, and Defect Metrology teams to eliminate systematic yield losses. Perform root-cause analysis leveraging on state-of-the-art FI/FA.
• Establish strong correlations between inline process metrics and end-of-line yield performance to improve process control and production predictability.

Cross-Functional Interface and Customer Management

• Act as the primary technical liaison and process technology expert between external foundry customers and internal stakeholders across LTD, DTP, CEG, Q and R, APTM, and IFS.
• Provide regular, data-driven updates on process development progress, product health, and key technical milestones to senior leadership and customer teams.
• Coordinate customer technology deliverables and maintain the product Plan of Record (POR) to ensure alignment with execution plans.
• Own and manage cross-functional responses to customer requests and technical challenges related to process technology and manufacturing execution.

Benefits

Inte