Technical Staff Engineer - Process Integration

FHLB Des Moines; San Jose (CA); On-site; USD 91,000 - 232,000; Full time

Job summary

Microchip Technology Inc. invites applications for a Technical Staff Process Integration Engineer to lead development of next‑generation embedded flash memory technology, driving process setup, silicon validation, and reliability qualification on tight schedules.

The role includes cross‑functional leadership across teams, collaboration with foundries, and exposure to memory solution production. Travel 0%–25% is expected.

Qualifications

• In‑depth knowledge of advanced‑node CMOS process integration and device physics.
• Strong analytical, organizational, and communication skills.
• Experience in non‑volatile memory technology development; flash memory array characterization is a plus.
• Proficiency in TCAD, PDK, circuit design, layout, device/product characterization, reliability, and qualification.
• Ability to work well in fast‑paced, multifunctional, multi‑time‑zone teams.
• Strong analytical, organizational, and communication skills.
• Ability to work well in fast‑paced, multifunctional, multi‑time‑zone teams.

Responsibilities

• Embedded flash memory technology development, including process integration, design rule scaling, device optimization, failure analysis, and yield enhancement.
• Technical project management: manage cross‑functional and cross‑organizational teams to accomplish process setup, test chip tape‑out, silicon validation, yield demonstration, and reliability qualification on schedule.
• Interface with foundry, IDM, and design house partners.

Skills

CMOS process integration

Device physics

TCAD

PDK

Circuit design

Layout

Reliability qualification

Cross-functional teamwork

Education

Bachelor's degree in Electrical Engineering

Tools

TCAD

PDK

Device characterization tools

Layout

Device characterization

Reliability

Qualification

Job description

Job Description

We are seeking a Technical Staff Process Integration Engineer to lead development of next‑generation embedded flash memory technology. The role drives process setup, silicon validation, and reliability qualification on tight schedules, working with industry experts and foundries to take memory solutions from concept to production.

Responsibilities

• Embedded flash memory technology development, including process integration, design rule scaling, device optimization, failure analysis, and yield enhancement.
• Technical project management: manage cross‑functional and cross‑organizational teams to accomplish process setup, test chip tape‑out, silicon validation, yield demonstration, and reliability qualification on schedule.
• Interface with foundry, IDM, and design house partners.

Requirements / Qualifications

• In‑depth knowledge of advanced‑node CMOS process integration and device physics.
• Strong analytical, organizational, and communication skills.
• Experience in non‑volatile memory technology development; flash memory array characterization is a plus.
• Proficiency in TCAD, PDK, circuit design, layout, device/product characterization, reliability, and qualification.
• Ability to work well in fast‑paced, multifunctional, multi‑time‑zone teams.
• Bachelor’s degree in Electrical Engineering or related major.
• 12+ years of relevant industry experience in semiconductor process integration.

Work Conditions

Travel: 0% – 25%.

Physical requirements: 80% sitting, 10% walking, 10% standing. Requires ability to feel, hear, see, talk, work alone, and around others.

Compensation

Annual base salary range U.S.: $91,000 – $232,000, depending on location and experience.

Equal Opportunity Employer

Microchip Technology Inc is an equal opportunity/affirmative action employer. All qualified applicants will receive consideration for employment without regard to sex, gender identity, sexual orientation, race, color, religion, national origin, disability, protected veteran status, age, or any other characteristic protected by law.