Technical Program Manager, Product Software

Tenstorrent

Santa Clara (CA)

Hybrid

USD 100,000 - 500,000

Full time

14 days+

Get more replies from employers

Send a job-specific resume in minutes.

Job summary

Tenstorrent is on the lookout for a Technical Program Manager to drive the software development of next-generation Chiplet based SiP. This hybrid role is based in Santa Clara, CA, Austin, TX, or Toronto, ON, requiring strong expertise in silicon development.

Responsibilities include managing multi-year software roadmaps, defining metrics, and overseeing integrations across diverse teams. For candidates with a robust background in chip-level engineering and technical program management, this is a unique opportunity to shape the future of AI technology.

Qualifications

  • 10+ years of experience in technical program management or chip-level engineering.
  • Familiar with heterogeneous compute architectures.
  • Proven ability to manage 40+ engineer programs.

Responsibilities

  • Devise and manage multi-year software roadmaps.
  • Define success metrics and drive work breakdown structures.
  • Manage vendor software integrations.

Skills

Technical program management
Chip-level engineering
Hardware-software co-design
JIRA
Confluence

Job description

Technical Program Manager, Product Software

Tenstorrent is leading the industry on cutting‑edge AI technology, revolutionizing performance expectations, ease of use, and cost efficiency. With AI redefining the computing paradigm, solutions must evolve to unify innovations in software models, compilers, platforms, networking, and semiconductors. Our diverse team of technologists have developed a high performance RISC‑V CPU from scratch, and share a passion for AI and a deep desire to build the best AI platform possible. We value collaboration, curiosity, and a commitment to solving hard problems. We are growing our team and looking for contributors of all seniorities.

Tenstorrent is on a quest to find a strong Technical Program Manager to lead the end‑to‑end software development of our next‑generation Chiplet based SiP. The scope spans from architecture to tape‑out, silicon debug and software productization – across AI, CPU, Memory and I/O Chiplet domains. If you bring strong expertise in silicon development and exceptional Program Management skills you will thrive in this role. You’ll drive end‑to‑end software across pre‑silicon and post silicon stages – building complex programs, defining program metrics, pushing boundaries and innovating in the AI Supercomputers space.

This role is Hybrid, based out of Santa Clara, CA, Austin, TX, or Toronto, ON.

We welcome candidates at various experience levels for this role. During the interview process, candidates will be assessed for the appropriate level, and offers will align with that level, which may differ from the one in this posting.

Who You Are
  • 10+ years of experience in technical program management or chip‑level engineering, with 2+ years in multi‑chip/chiplet systems.
  • Familiar with heterogeneous compute architectures (AI, CPU, memory, networking) and early software phases (architecture, pre‑/post‑silicon).
  • Proven ability to manage 40+ engineer programs, external vendors (PCIe, D2D, Ethernet), and full software stacks from bare‑metal to ML frameworks.
  • Strong understanding of hardware‑software co‑design at chiplet, package, and system levels.
  • Highly organized, adaptable, and expert in tools like JIRA, Confluence, and fast‑paced decision making.
What We Need
  • Devise and manage multi‑year software roadmaps and coordinate across silicon, firmware, and runtime teams.
  • Define success metrics, drive work breakdown structures, and track progress with strong risk management and alignment strategies.
  • Own shift‑left strategies to de‑risk bring‑up and accelerate time‑to‑market.
  • Manage vendor software integrations (PCIe, D2D, Ethernet), and set up robust CI/CD and testing frameworks.
  • Communicate clearly with executives, engineers, and stakeholders, balancing transparency with thoughtful trade‑off discussions.
What You Will Learn
  • Deep experience with chiplet integration across AI, CPU, Memory, and I/O – and how these technologies drive system performance.
  • Hands‑on with Tenstorrent’s open‑source compiler, runtime, and firmware stack.
  • Exposure to pre‑/post‑silicon methodologies and industry‑leading “shift‑left” program strategies.
  • Collaborate with top‑tier vendors and engage in real‑world open‑source vs. licensed IP tradeoffs.
  • Learn how program strategy evolves at the cutting edge of RISC‑V, AI, and HPC chiplet ecosystems.

Compensation for all engineers at Tenstorrent ranges from $100k – $500k including base and variable compensation targets. Experience, skills, education, background and location all impact the actual offer made.

Tenstorrent offers a highly competitive compensation package and benefits, and we are an equal opportunity employer.

This offer of employment is contingent upon the applicant being eligible to access U.S. export‑controlled technology. Due to U.S. export laws, including those codified in the U.S. Export Administration Regulations (EAR), the Company is required to ensure compliance with these laws when transferring technology to nationals of certain countries (such as EAR Country Groups D:1, E1, and E2). These requirements apply to persons located in the U.S. and all countries outside the U.S. As the position offered will have direct and/or indirect access to information, systems, or technologies subject to these laws, the offer may be contingent upon your citizenship/permanent residency status or ability to obtain prior license approval from the U.S. Commerce Department or applicable federal agency. If employment is not possible due to U.S. export laws, any offer of employment will be rescinded.

We do not discriminate on the basis of any protected group status under any applicable law.

Get your free, confidential resume review.
or drag and drop your file here.
Similar jobs

Similar jobs worth comparing

Technical Program Manager, Architecture
Technical Program Manager, Architecture

Tenstorrent • Santa Clara (CA)

Hybrid
USD 100,000 - 500,000
Competitive compensation package
Health benefits
Equal opportunity employer
Staff Technical Program Manager, Physical Design
Staff Technical Program Manager, Physical Design

Tenstorrent • Austin (TX)

Hybrid
USD 100,000 - 500,000
Highly competitive compensation package
Benefits included
Equal opportunity employer
Staff Technical Program Manager, Physical Design
Staff Technical Program Manager, Physical Design

Tenstorrent • United States

Hybrid
USD 100,000 - 500,000
Highly competitive compensation package
Benefits
Equal opportunity employer
Staff Technical Program Manager, Physical Design
Staff Technical Program Manager, Physical Design

Tenstorrent • Santa Clara (CA)

Hybrid
USD 100,000 - 500,000
Competitive compensation package
Equal opportunity employer
Sr Engineer, AI Kernel
Sr Engineer, AI Kernel

Tenstorrent • United States

Hybrid
USD 100,000 - 500,000
Competitive compensation package
Benefits include health and wellness programs
Sr Engineer, AI Kernel
Sr Engineer, AI Kernel

Tenstorrent • Austin (TX)

Hybrid
USD 100,000 - 500,000
Competitive compensation package
Benefits included
Hardware - Architecture - Architecture Chiplet Physical Design Engineer
Hardware - Architecture - Architecture Chiplet Physical Design Engineer

Tenstorrent Inc. • United States

Remote
USD 100,000 - 500,000
Highly competitive compensation package
Equal opportunity employer
Comprehensive benefits
Engineering Program Manager, RISCV
Engineering Program Manager, RISCV

Tenstorrent • Austin (TX)

Hybrid
USD 100,000 - 500,000
Highly competitive compensation package
Benefits offered
Staff, Component Engineer
Staff, Component Engineer

Tenstorrent • United States

On-site
USD 100,000 - 500,000
Highly competitive compensation package
Benefits included
Top Level Physical Design Engineer
Top Level Physical Design Engineer

Tenstorrent • Santa Clara (CA)

Hybrid
USD 100,000 - 500,000
Highly competitive compensation package
Benefits offered