Technical Program Manager II

Spectraforce Technologies; Raleigh (NC); Remote; USD 120,000 - 170,000; Full time

Job summary

Spectraforce Technologies, Inc. is seeking a Technical Program Manager II for a 12-month remote engagement (PST preferred) focused on AR wearable devices.

You will own PCB design releases (flexes and MLBs), manage SMT/FATP builds end-to-end, and partner with APAC manufacturers to ensure readiness and successful part fabrication. Applicants should have 5+ years in electrical design or hardware engineering, with wearables or consumer electronics experience preferred.

Qualifications

• Direct ownership of design releases for flexes and MLBs from early design to production.
• End-to-end SMT and FATP builds with emphasis on schedule, quality, and yield.
• Hands-on APAC contract manufacturer management, including vendor engagement and readiness.

Responsibilities

• End-to-end ownership of PCB fabrication from schematics to vendor approval for part fabrication.
• Collaborate with electrical engineers and cross-functional teams to develop flex circuits and rigid boards.
• Engage with APAC contract manufacturers, ensuring supplier readiness and managing vendor relationships.
• Track schedules and risks throughout the development process.

Skills

Design release ownership

SMT & FATP end-to-end

APAC vendor management

Education

Electrical Engineering degree preferred

Job description

Title: Technical Program Manager II

Location: Remote (PST Preferred)

Duration: 12 months

Description:

• This role supports a business group focused on developing next-generation AR wearable devices. The team is driving innovation in flexible and rigid circuit board design, enabling advanced features in compact form factors.
• The need arises from increased project volume and the complexity of integrating new electrical components into wearable products.

Responsibilities

• Responsible for electrical parts and components in big tech, with a focus on AR wearables and small electrical components.
• Work outside standard hours to accommodate collaboration with APAC vendors.
• End-to-end ownership of PCB fabrication, including schematics, layouts, and form development through to execution and vendor approval for part fabrication.
• Experience in wearables, especially AR wearables and small electrical components.

Key Projects/Day-to-Day Responsibilities

• Direct ownership of design releases for flexes and MLBs (multi-layer boards) from early design through production.
• Collaborate with electrical engineers and cross-functional teams to develop flexible circuits and rigid circuit boards.
• Gather feedback, track schedules, and highlight risks throughout the development process.
• Manage SMT (Surface Mount Technology) and FATP (Final Assembly, Test, and Pack) builds end-to-end, optimizing for schedule, quality, and yield.
• Engage directly with APAC contract manufacturers, ensuring supplier readiness and managing flex vendor relationships.

Must-Have Skills

• Direct ownership of design releases for flexes and MLBs (multi-layer boards) from early design through production.
• Managing SMT and FATP builds end-to-end, including schedule, quality, and yield optimization.
• Hands-on APAC CM (Contract Manufacturer) management, including flex vendor engagement and supplier readiness.

Nice-to-Have Skills

• Experience with AR wearable device development.
• Familiarity with small electrical component integration in compact form factors.
• Knowledge of advanced PCB fabrication techniques and materials.

Years of Experience

• Minimum 5 years in electrical design, PCB development, or related hardware engineering roles.
• Experience in wearables or consumer electronics preferred.

Degrees/Certifications Required

• Degree in Electrical Engineering or related field preferred, but not required.
• Relevant experience is more important than formal education.